Inventor · disambiguated record
Ting Li
Also filed as: LI TING · LI TING NAN
8 granted patents·2 pending applications·0 citations·filing 2007–2024
70Inventor score
Files withHUNAN TAOHUAJIANG BAMBOO SCIENCE & TECH CO LTD4WUHAN CHOICE TECH CO LTD3Baidu online network technology beijing co ltd1LAI TZUNG SHEN1NAT CENTER FOR ADVANCED PACKAGING CO LTD1
Top patents by PatentIndex Score
10 records- 0168US12252613B1Packaging film and preparation method thereof, and filter chip packaging methodWUHAN CHOICE TECH CO LTD·Filed 2024·Granted Mar 18, 2025·0 cites·12 claims
- 0261US11767450B2Adhesive, die attach film and preparation method thereforWUHAN CHOICE TECH CO LTD·Filed 2023·Granted Sep 26, 2023·0 cites·10 claims
- 0360US11879076B1Composition, adhesive film and chip packaging structureWUHAN CHOICE TECH CO LTD·Filed 2023·Granted Jan 23, 2024·0 cites·11 claims
- 0447US11313694B2Method and apparatus for recommending travel wayBaidu online network technology beijing co ltd·Filed 2020·Granted Apr 26, 2022·0 cites·15 claims
- 0547US2023211520A1Reconstituted bamboo board integrating embossed texture decoration and protective functionsHUNAN TAOHUAJIANG BAMBOO SCIENCE & TECH CO LTD·Filed 2022·Application pending·0 cites
- 0640US2009084515A1Paper pulp mold and pulp molded articles thereofLAI TZUNG SHEN·Filed 2007·Application pending·0 cites
- 0739US12152350B2One-step integrally-formed bamboo sleeper and preparation method thereofHUNAN TAOHUAJIANG BAMBOO SCIENCE & TECH CO LTD·Filed 2019·Granted Nov 26, 2024·0 cites·17 claims
- 0838US9589786B2Method for polishing a polymer surfaceNAT CENTER FOR ADVANCED PACKAGING CO LTD·Filed 2015·Granted Mar 7, 2017·0 cites·19 claims
- 0936US12203224B2Assembled bamboo sleeper and preparation method thereofHUNAN TAOHUAJIANG BAMBOO SCIENCE & TECH CO LTD·Filed 2019·Granted Jan 21, 2025·0 cites·11 claims
- 1033US11919192B2Bamboo chip integrated material and manufacturing method thereofHUNAN TAOHUAJIANG BAMBOO SCIENCE & TECH CO LTD·Filed 2019·Granted Mar 5, 2024·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →