Inventor · disambiguated record
Tim V. Pham
Also filed as: PHAM TIM V
15 granted patents·1 pending application·53 citations·filing 2002–2015
89Inventor score
Top patents by PatentIndex Score
16 records- 0187US8008786B2Dynamic pad size to reduce solder fatigueFREESCALE SEMICONDUCTOR INC·Filed 2010·Granted Aug 30, 2011·7 cites·20 claims
- 0286US8860212B1Fluid cooled semiconductor die packageFOONG CHEE SENG·Filed 2013·Granted Oct 14, 2014·9 cites·18 claims
- 0386US7772104B2Dynamic pad size to reduce solder fatigueFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Aug 10, 2010·13 cites·18 claims
- 0474US10177052B2Defective die replacement in a die stackFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jan 8, 2019·3 cites·13 claims
- 0574US9281256B2Package encapsulant relief featureDING MIN·Filed 2013·Granted Mar 8, 2016·4 cites·20 claims
- 0662US9318451B2Wirebond recess for stacked diePHAM TIM V·Filed 2013·Granted Apr 19, 2016·2 cites·19 claims
- 0761US9480161B2Thin low profile strip dual in-line memory moduleFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Oct 25, 2016·1 cites·20 claims
- 0861US6905891B2Method for processing multiple semiconductor devices for testFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jun 14, 2005·13 cites·19 claims
- 0960US8970026B2Methods and structures for reducing stress on die assemblyLEAL GEORGE R·Filed 2013·Granted Mar 3, 2015·1 cites·20 claims
- 1053US10002653B2Die stack address bus having a programmable widthFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Jun 19, 2018·0 cites·11 claims
- 1148US9159643B2Matrix lid heatspreader for flip chip packageLEAL GEORGE R·Filed 2012·Granted Oct 13, 2015·0 cites·13 claims
- 1246US9640469B2Matrix lid heatspreader for flip chip packageLEAL GEORGE R·Filed 2015·Granted May 2, 2017·0 cites·15 claims
- 1343US9087702B2Edge coupling of semiconductor diesFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Jul 21, 2015·0 cites·11 claims
- 1440US9070657B2Heat conductive substrate for integrated circuit packageFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted Jun 30, 2015·0 cites·19 claims
- 1537US8957510B2Using an integrated circuit die configuration for package height reductionPHAM TIM V·Filed 2013·Granted Feb 17, 2015·0 cites·20 claims
- 1636US2015069624A1Recessed semiconductor die stackFREESCALE SEMICONDUCTOR INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →