Inventor · disambiguated record
Timothy M. Sullivan
Also filed as: SULLIVAN TIMOTHY M · SULLIVAN TIMOTHY MICHAEL
40 granted patents·16 pending applications·213 citations·filing 1982–2024
97Inventor score
Files withIBM11WISSNER-GROSS ALEXANDER D7GLOBALFOUNDRIES INC6MICROSOFT TECHNOLOGY LICENSING LLC6AYOTTE STEPHEN P5
Top patents by PatentIndex Score
56 records- 0197US9508680B1Induction heating for underfill removal and chip reworkGLOBALFOUNDRIES INC·Filed 2015·Granted Nov 29, 2016·28 cites·16 claims
- 0296US10838452B2Computing device display bondingMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2019·Granted Nov 17, 2020·17 cites·20 claims
- 0396US9472490B1IC structure with recessed solder bump area and methods of forming sameGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 18, 2016·18 cites·17 claims
- 0488US9776270B2Chip joining by induction heatingGLOBALFOUNDRIES INC·Filed 2013·Granted Oct 3, 2017·7 cites·7 claims
- 0587US10200016B2Contactless readable programmable transponder to monitor chip joinIBM·Filed 2017·Granted Feb 5, 2019·3 cites·5 claims
- 0685US11162633B2Magnetic mount for electronic devicesMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2019·Granted Nov 2, 2021·7 cites·20 claims
- 0785US10601404B2Contactless readable programmable transponder to monitor chip joinIBM·Filed 2018·Granted Mar 24, 2020·2 cites·20 claims
- 0885US10245667B2Chip joining by induction heatingGLOBALFOUNDRIES INC·Filed 2017·Granted Apr 2, 2019·3 cites·8 claims
- 0985US9711422B2Visually detecting electrostatic discharge eventsGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 18, 2017·4 cites·19 claims
- 1081US9190375B2Solder bump reflow by induction heatingIBM·Filed 2014·Granted Nov 17, 2015·6 cites·20 claims
- 1180US9216363B2Flying toy figurineSPIN MASTER LTD·Filed 2013·Granted Dec 22, 2015·6 cites·18 claims
- 1277US9876487B2Contactless readable programmable transponder to monitor chip joinIBM·Filed 2013·Granted Jan 23, 2018·2 cites·10 claims
- 1377US9704830B1Semiconductor structure and method of makingIBM·Filed 2016·Granted Jul 11, 2017·2 cites·16 claims
- 1477US8829674B2Stacked multi-chip package and method of making sameIBM·Filed 2013·Granted Sep 9, 2014·4 cites·12 claims
- 1574US11169576B2Folding accessory device supportMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2020·Granted Nov 9, 2021·1 cites·20 claims
- 1674US6432697B1Transparent sample containerBECTON DICKINSON CO·Filed 2000·Granted Aug 13, 2002·15 cites·16 claims
- 1773US9548275B2Detecting sudden changes in acceleration in semiconductor device or semiconductor packaging containing semiconductor deviceGLOBALFOUNDRIES INC·Filed 2013·Granted Jan 17, 2017·4 cites·20 claims
- 1869US9105573B2Visually detecting electrostatic discharge eventsAYOTTE STEPHEN P·Filed 2012·Granted Aug 11, 2015·2 cites·21 claims
- 1969US4895548ACollapsible construction setTONKA CORP KENNER DIVISION·Filed 1988·Granted Jan 23, 1990·28 cites·2 claims
- 2067US11075619B2Contactless readable programmable transponder to monitor chip joinIBM·Filed 2019·Granted Jul 27, 2021·0 cites·20 claims
- 2166US8765593B2Controlled collapse chip connection (C4) structure and methods of formingAYOTTE STEPHEN P·Filed 2012·Granted Jul 1, 2014·2 cites·13 claims
- 2266US2014266980A1Providing an Altered Shopping Experience in Retail EnvironmentsWISSNER-GROSS ALEXANDER D·Filed 2014·Application pending·0 cites
- 2366US2014258031A1Identifying Where to Buy Ingredients of a RecipeWISSNER-GROSS ALEXANDER D·Filed 2014·Application pending·0 cites
- 2462US9059097B2Inhibiting propagation of imperfections in semiconductor devicesAYOTTE STEPHEN P·Filed 2012·Granted Jun 16, 2015·1 cites·9 claims
- 2559US8426856B2Thermally sensitive material embedded in the substrateAYOTTE STEPHEN P·Filed 2010·Granted Apr 23, 2013·1 cites·17 claims
- 2658US8862721B2Environmental footprint monitor for computer networksWISSNER-GROSS ALEXANDER DAVID·Filed 2008·Granted Oct 14, 2014·2 cites·9 claims
- 2758US8453843B1Tray for transporting semiconductor devices of a BGA typeAYOTTE JR STEPHEN PETER·Filed 2012·Granted Jun 4, 2013·2 cites·16 claims
- 2858US4479663AHandlebar mounting for a fairingMORRIS LEWIS R·Filed 1982·Granted Oct 30, 1984·21 cites·16 claims
- 2958US2024383621A1Neural Network Safety CheckADVANCED SPACE LLC·Filed 2024·Application pending·0 cites
- 3057US11662767B2Computing device display bondingMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2020·Granted May 30, 2023·0 cites·20 claims
- 3156US8230903B2Low profile heat sink for semiconductor devicesAYOTTE STEPHEN P·Filed 2008·Granted Jul 31, 2012·2 cites·6 claims
- 3255US2013146219A1Cosmetic Restoration of Stainless Steel SurfacesSULLIVAN TIMOTHY M·Filed 2012·Application pending·0 cites
- 3354USD283811SClear handlebar fairingVETTER PRODUCTS INC·Filed 1983·Granted May 13, 1986·7 cites·1 claims
- 3453US2025130048A1Incremental Neural Network Model InferenceADVANCED SPACE LLC·Filed 2024·Application pending·0 cites
- 3553US2013346204A1In-Store Guidance Systems and MethodsWISSNER-GROSS ALEXANDER D·Filed 2012·Application pending·0 cites
- 3653US2025136301A1Almanac of Neural Network ModelsADVANCED SPACE LLC·Filed 2024·Application pending·0 cites
- 3753US2014006152A1Providing a Proximity Triggered Response in a Video DisplayWISSNER-GROSS ALEXANDER D·Filed 2012·Application pending·0 cites
- 3853US2014164123A1User Interface for Accessing Information About a Retail StoreWISSNER-GROSS ALEXANDER D·Filed 2012·Application pending·0 cites
- 3952US10248158B2Enclosure assembly and monitor device including sameMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2016·Granted Apr 2, 2019·1 cites·21 claims
- 4051US7915732B2Production of integrated circuit chip packages prohibiting formation of micro solder ballsINTERNAT BUSINESS MAHINES CORP·Filed 2008·Granted Mar 29, 2011·0 cites·4 claims
- 4151US2014006159A1Providing an Altered Shopping Experience in Retail EnvironmentsWISSNER-GROSS ALEXANDER D·Filed 2012·Application pending·0 cites
- 4250US6432665B1Method of detecting microorganisms utilizing transparent sample containerBECTON DICKINSON CO·Filed 2000·Granted Aug 13, 2002·9 cites·8 claims
- 4347USD694837SFlying toySPIN MASTER LTD·Filed 2013·Granted Dec 3, 2013·5 cites·1 claims
- 4447US7770680B2Hood mount assemblyPACCAR INC·Filed 2007·Granted Aug 10, 2010·1 cites·14 claims
- 4546US10050012B2Method for semiconductor die removal reworkIBM·Filed 2015·Granted Aug 14, 2018·0 cites·13 claims
- 4646US7745256B2Rectangular-shaped controlled collapse chip connectionIBM·Filed 2008·Granted Jun 29, 2010·0 cites·5 claims
- 4746US2014004940A1Providing Recreation and Social Activities in Retail EnvironmentsWISSNER-GROSS ALEXANDER D·Filed 2012·Application pending·0 cites
- 4845US7839002B2Partially underfilled solder grid arraysIBM·Filed 2008·Granted Nov 23, 2010·0 cites·8 claims
- 4945US2008299874A1Method for restoring acid etched glassSULLIVAN TIMOTHY M·Filed 2007·Application pending·0 cites
- 5044US9177931B2Reducing thermal energy transfer during chip-join processingIBM·Filed 2014·Granted Nov 3, 2015·0 cites·19 claims
Showing the top 50 of 56 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →