Inventor · disambiguated record
Tian San Tan
Also filed as: TAN TIAN · TAN TIAN SAN
14 granted patents·5 pending applications·12 citations·filing 2013–2024
84Inventor score
Files withINFINEON TECHNOLOGIES AG8HANGZHOU DPTECH TECHNOLOGIES CO LTD3INFINEON TECHNOLOGIES AUSTRIA AG2MICROSOFT TECHNOLOGY LICENSING LLC2UNIV CITY HONG KONG2
Top patents by PatentIndex Score
19 records- 0181US9837380B2Semiconductor device having multiple contact clipsINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Dec 5, 2017·7 cites·20 claims
- 0274US9252063B2Extended contact area for leadframe strip testingINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 2, 2016·3 cites·17 claims
- 0362US2025364536A1Materials for Use in Batteries and Methods of Manufacturing the Same, and BatteriesLAU LEE CHEUNG·Filed 2024·Application pending·0 cites
- 0458US12470483B2Data packet traffic using speculative unified flowMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2022·Granted Nov 11, 2025·0 cites·18 claims
- 0558US9490199B2Interposer with programmable matrix for realizing configurable vertical semiconductor package arrangementsINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 8, 2016·2 cites·19 claims
- 0654US11610392B1Methods, devices, and systems for identifying the composition of materialsHANGZHOU TIANYAN ZHILIAN TECH CO LTD·Filed 2022·Granted Mar 21, 2023·0 cites·18 claims
- 0748US11626585B2Electrode material and a method of preparing the sameUNIV CITY HONG KONG·Filed 2018·Granted Apr 11, 2023·0 cites·19 claims
- 0846US9892991B2Connectable package extender for semiconductor device packageINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 13, 2018·0 cites·14 claims
- 0945US9508625B2Semiconductor die package with multiple mounting configurationsINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 29, 2016·0 cites·33 claims
- 1043US11385900B2Accessing queue dataHANGZHOU DPTECH TECHNOLOGIES CO LTD·Filed 2019·Granted Jul 12, 2022·0 cites·12 claims
- 1143US2021234152A1Material for use in a battery, a battery and a method of manufacturing a material for use in a batteryUNIV CITY HONG KONG·Filed 2020·Application pending·0 cites
- 1242US9666557B2Small footprint semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 30, 2017·0 cites·26 claims
- 1342US9484280B2Semiconductor device and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Nov 1, 2016·0 cites·14 claims
- 1442US2018102300A1Connectable Package Extender for Semiconductor Device PackageINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
- 1541US2024422106A1System and method for processing networking packets using a reorder queueMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2023·Application pending·0 cites
- 1641US2015214179A1Semiconductor device including flexible leadsINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 1739US11709912B2Abnormality detectionHANGZHOU DPTECH TECHNOLOGIES CO LTD·Filed 2020·Granted Jul 25, 2023·0 cites·9 claims
- 1838US10491636B2Managing security policyHANGZHOU DPTECH TECHNOLOGIES CO LTD·Filed 2017·Granted Nov 26, 2019·0 cites·12 claims
- 1935US9153518B2Molded semiconductor package with pluggable leadINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 6, 2015·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →