Inventor · disambiguated record
Tien Fak Tan
Also filed as: TAN TIEN · TAN TIEN FAK · TAN TIEN TJIU
15 granted patents·9 pending applications·162 citations·filing 2002–2024
90Inventor score
Top patents by PatentIndex Score
24 records- 0197US9659753B2Grooved insulator to reduce leakage currentAPPLIED MATERIALS INC·Filed 2014·Granted May 23, 2017·123 cites·12 claims
- 0295US11834744B2Ceramic showerheads with conductive electrodesAPPLIED MATERIALS INC·Filed 2023·Granted Dec 5, 2023·2 cites·20 claims
- 0394US10504754B2Systems and methods for improved semiconductor etching and component protectionAPPLIED MATERIALS INC·Filed 2016·Granted Dec 10, 2019·16 cites·13 claims
- 0489US9972477B2Multiple point gas delivery apparatus for etching materialsAPPLIED MATERIALS INC·Filed 2015·Granted May 15, 2018·6 cites·12 claims
- 0582US11915911B2Two piece electrode assembly with gap for plasma controlAPPLIED MATERIALS INC·Filed 2020·Granted Feb 27, 2024·1 cites·20 claims
- 0680US8333842B2Apparatus for etching semiconductor wafersLUBOMIRSKY DMITRY·Filed 2008·Granted Dec 18, 2012·7 cites·18 claims
- 0775US10920319B2Ceramic showerheads with conductive electrodesAPPLIED MATERIALS INC·Filed 2019·Granted Feb 16, 2021·1 cites·14 claims
- 0874US10699879B2Two piece electrode assembly with gap for plasma controlAPPLIED MATERIALS INC·Filed 2018·Granted Jun 30, 2020·1 cites·20 claims
- 0974US10522371B2Systems and methods for improved semiconductor etching and component protectionAPPLIED MATERIALS INC·Filed 2016·Granted Dec 31, 2019·2 cites·19 claims
- 1073US11101136B2Process window widening using coated parts in plasma etch processesAPPLIED MATERIALS INC·Filed 2019·Granted Aug 24, 2021·1 cites·20 claims
- 1172US10297458B2Process window widening using coated parts in plasma etch processesAPPLIED MATERIALS INC·Filed 2017·Granted May 21, 2019·1 cites·20 claims
- 1271US11591693B2Ceramic showerheads with conductive electrodesAPPLIED MATERIALS INC·Filed 2021·Granted Feb 28, 2023·0 cites·6 claims
- 1364US11302520B2Chamber apparatus for chemical etching of dielectric materialsAPPLIED MATERIALS INC·Filed 2015·Granted Apr 12, 2022·1 cites·9 claims
- 1457US11735441B2Systems and methods for improved semiconductor etching and component protectionAPPLIED MATERIALS INC·Filed 2019·Granted Aug 22, 2023·0 cites·20 claims
- 1557US2025391671A1Reaction chamber with multi phase precursor deliveryAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1656US2025379052A1Amorphous multi-metal-doped film for hardmask applicationAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1755US2010071210A1Methods for fabricating faceplate of semiconductor apparatusAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 1843US2019304756A1Semiconductor chamber coatings and processesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1942US2020087788A1Multiple channel showerheadsAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 2041US2016237570A1Gas delivery apparatus for process equipmentAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 2140US12340979B2Semiconductor processing chamber for improved precursor flowAPPLIED MATERIALS INC·Filed 2018·Granted Jun 24, 2025·0 cites·20 claims
- 2237US2012285621A1Semiconductor chamber apparatus for dielectric processingTAN TIEN FAK·Filed 2011·Application pending·0 cites
- 2336US2012074126A1Wafer profile modification through hot/cold temperature zones on pedestal for semiconductor manufacturing equipmentBANG WON B·Filed 2011·Application pending·0 cites
- 2433US2003134106A1Polyolefin film for use as a non-staining masking filmFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →