Inventor · disambiguated record
Tien-I Wu
Also filed as: WU TIEN-I
10 granted patents·2 pending applications·18 citations·filing 2015–2021
81Inventor score
Files withUNITED MICROELECTRONICS CORP12
Top patents by PatentIndex Score
12 records- 0194US9673324B1MOS device with epitaxial structure associated with source/drain region and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 6, 2017·14 cites·20 claims
- 0282US10510609B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 17, 2019·2 cites·1 claims
- 0375US9748386B2Epitaxial structure of semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 29, 2017·2 cites·20 claims
- 0472US11587835B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Feb 21, 2023·0 cites·7 claims
- 0565US11062953B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jul 13, 2021·0 cites·9 claims
- 0657US10446447B2Method for fabricating a curve on sidewalls of a fin-shaped structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 15, 2019·0 cites·7 claims
- 0752US10056490B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 21, 2018·0 cites·5 claims
- 0843US9748147B1Method of fabricating epitaxial layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 29, 2017·0 cites·10 claims
- 0937US9741818B2Manufacturing method of semiconductor structure for improving quality of epitaxial layersUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 22, 2017·0 cites·12 claims
- 1035US10497797B2Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Granted Dec 3, 2019·0 cites·6 claims
- 1134US2017294540A1Semiconductor structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 1234US2017133460A1Semiconductor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →