Inventor · disambiguated record
Timothy P. Younger
Also filed as: YOUNGER TIMOTHY · YOUNGER TIMOTHY P
20 granted patents·2 pending applications·31 citations·filing 2013–2023
90Inventor score
Top patents by PatentIndex Score
22 records- 0196US10575448B1Electromagnetic shielding of heat sinks with shape-memory alloy groundingIBM·Filed 2018·Granted Feb 25, 2020·20 cites·20 claims
- 0294US11699884B2Electromagnetic shielding of heatsinks with spring press-fit pinsIBM·Filed 2020·Granted Jul 11, 2023·4 cites·4 claims
- 0388US12016127B2Liquid metal infiltration rework of electronic assemblyIBM·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 0485US11310950B2Liquid metal infiltration rework of electronic assemblyIBM·Filed 2019·Granted Apr 19, 2022·1 cites·13 claims
- 0581US11278977B2Liquid metal infiltration rework of electronic assemblyIBM·Filed 2019·Granted Mar 22, 2022·2 cites·20 claims
- 0677US11751369B2Liquid metal infiltration rework of electronic assemblyIBM·Filed 2022·Granted Sep 5, 2023·0 cites·8 claims
- 0776US10262907B1Dye and pry process for removing quad flat no-lead packages and bottom termination componentsIBM·Filed 2017·Granted Apr 16, 2019·2 cites·13 claims
- 0868US12256494B2Modified internal clearance(s) at connector pin aperture(s) of a circuit boardIBM·Filed 2022·Granted Mar 18, 2025·0 cites·25 claims
- 0967US10677856B2Facilitating reliable circuit board press-fit connector assembly fabricationIBM·Filed 2018·Granted Jun 9, 2020·2 cites·20 claims
- 1060US11906574B2Hybrid socket warp indicatorIBM·Filed 2021·Granted Feb 20, 2024·0 cites·7 claims
- 1158US10593601B2Dye and pry process for removing quad flat no-lead packages and bottom termination componentsIBM·Filed 2019·Granted Mar 17, 2020·0 cites·11 claims
- 1256US11445650B2Localized rework using liquid media solderingIBM·Filed 2019·Granted Sep 13, 2022·0 cites·20 claims
- 1355US12100910B2Shape-memory alloy lock for connectorsIBM·Filed 2021·Granted Sep 24, 2024·0 cites·13 claims
- 1455US2024170903A1Controlled extraction of electronic connector from electronic connector boardIBM·Filed 2022·Application pending·0 cites
- 1553US2024237228A9Reworking solder component without part removalIBM·Filed 2022·Application pending·0 cites
- 1651US10834839B1Barrier for hybrid socket movement reductionIBM·Filed 2019·Granted Nov 10, 2020·0 cites·20 claims
- 1750US11245238B2Tool for shaping contact tab interconnects at a circuit card edgeIBM·Filed 2018·Granted Feb 8, 2022·0 cites·10 claims
- 1849US11175100B2Heat sinks using memory shaping materialsIBM·Filed 2019·Granted Nov 16, 2021·0 cites·10 claims
- 1948US11211760B2Stutter step press-fit connector insertion processIBM·Filed 2019·Granted Dec 28, 2021·0 cites·7 claims
- 2048US10881007B2Recondition process for BGA using fluxIBM·Filed 2017·Granted Dec 29, 2020·0 cites·15 claims
- 2145US11268809B2Detecting and correcting deficiencies in surface conditions for bonding applicationsIBM·Filed 2018·Granted Mar 8, 2022·0 cites·18 claims
- 2245US9537234B2Method of making a solder tail extender connectorGLOBALFOUNDRIES INC·Filed 2013·Granted Jan 3, 2017·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →