Inventor · disambiguated record
Tomoyuki Abe
Also filed as: ABE TOMOYUKI
58 granted patents·16 pending applications·948 citations·filing 1991–2025
99Inventor score
Top patents by PatentIndex Score
74 records- 0197US7224046B2Multilayer wiring board incorporating carbon fibers and glass fibersFUJITSU LTD·Filed 2005·Granted May 29, 2007·60 cites·10 claims
- 0295US8158503B2Multilayer interconnection substrate and method of manufacturing the sameABE TOMOYUKI·Filed 2006·Granted Apr 17, 2012·53 cites·7 claims
- 0393US10566219B2Chip transfer member, chip transfer apparatus, and chip transfer methodTOSHIBA ELECTRONIC DEVICES & STORAGE CORP·Filed 2018·Granted Feb 18, 2020·8 cites·12 claims
- 0493US7002080B2Multilayer wiring boardFUJITSU LTD·Filed 2003·Granted Feb 21, 2006·69 cites·9 claims
- 0592US7436679B2Radio-frequency module for communicationFUJITSU LTD·Filed 2005·Granted Oct 14, 2008·25 cites·12 claims
- 0692US7038142B2Circuit board and method for fabricating the same, and electronic deviceFUJITSU LTD·Filed 2003·Granted May 2, 2006·74 cites·12 claims
- 0792US5746868AMethod of manufacturing multilayer circuit substrateFUJITSU LTD·Filed 1995·Granted May 5, 1998·119 cites·18 claims
- 0891US6869665B2Wiring board with core layer containing inorganic fillerFUJITSU LTD·Filed 2003·Granted Mar 22, 2005·64 cites·12 claims
- 0989US8110749B2Printed wiring boardYOSHIMURA HIDEAKI·Filed 2009·Granted Feb 7, 2012·20 cites·4 claims
- 1089US7640660B2Method for manufacturing multilayer wiring board incorporating carbon fibers and glass fibersFUJITSU LTD·Filed 2007·Granted Jan 5, 2010·16 cites·3 claims
- 1189US7448825B2Method for continuous on-site recycling of an asphalt mixture layer of a pavement and a motor-driven vehicle system thereforGREEN ARM CO LTD·Filed 2007·Granted Nov 11, 2008·52 cites·30 claims
- 1288US7773035B2Microstrip antenna and high frequency sensor using microstrip antennaTOTO LTD·Filed 2005·Granted Aug 10, 2010·25 cites·33 claims
- 1388US7595228B2Method for manufacturing electronic component-mounted boardFUJITSU LTD·Filed 2005·Granted Sep 29, 2009·16 cites·4 claims
- 1484US7388157B2Printed wiring boardFUJITSU LTD·Filed 2005·Granted Jun 17, 2008·13 cites·10 claims
- 1583US7400035B2Semiconductor device having multilayer printed wiring boardFUJITSU LTD·Filed 2004·Granted Jul 15, 2008·29 cites·8 claims
- 1681US7550366B2Method for bonding substrates and device for bonding substratesAYUMI INDUSTRY·Filed 2005·Granted Jun 23, 2009·18 cites·11 claims
- 1779US9710974B2Video game processing apparatus and video game processing programSQUARE ENIX KK·Filed 2014·Granted Jul 18, 2017·5 cites·6 claims
- 1879US7429796B2Semiconductor device and fabrication process thereofFUJITSU LTD·Filed 2006·Granted Sep 30, 2008·7 cites·10 claims
- 1979US5240350AApparatus for detecting position of underground excavator and magnetic field producing cableKOMATSU MFG CO LTD·Filed 1991·Granted Aug 31, 1993·77 cites·20 claims
- 2078US10624238B2Loop heat pipe and manufacturing method for loop heat pipe and electronic deviceFUJITSU LTD·Filed 2018·Granted Apr 14, 2020·2 cites·17 claims
- 2178US8250680B2UrinalMURATA KENSUKE·Filed 2008·Granted Aug 28, 2012·7 cites·8 claims
- 2278US5976393AMethod of manufacturing multilayer circuit substrateFUJITSU LTD·Filed 1998·Granted Nov 2, 1999·44 cites·7 claims
- 2377US8186052B2Method of producing substrateIIDA KENJI·Filed 2008·Granted May 29, 2012·8 cites·11 claims
- 2476US10420253B2Loop heat pipe, manufacturing method thereof, and electronic deviceFUJITSU LTD·Filed 2018·Granted Sep 17, 2019·2 cites·19 claims
- 2576US8151456B2Method of producing substrateMAEHARA YASUTOMO·Filed 2008·Granted Apr 10, 2012·9 cites·5 claims
- 2676US7622184B2Multilevel interconnection board and method of fabricating the sameFUJITSU LTD·Filed 2006·Granted Nov 24, 2009·2 cites·7 claims
- 2776US7246435B2Wiring board and method for fabricating the sameFUJITSU LTD·Filed 2005·Granted Jul 24, 2007·5 cites·10 claims
- 2874US7915541B2Multilayer interconnection substrate and manufacturing method thereforFUJITSU LTD·Filed 2008·Granted Mar 29, 2011·5 cites·7 claims
- 2974US5330292ASystem and method for transmitting and calculating data in shield machineKOMATSU MFG CO LTD·Filed 1991·Granted Jul 19, 1994·41 cites·25 claims
- 3073US7420130B2Wiring board and method for fabricating the sameFUJITSU LTD·Filed 2007·Granted Sep 2, 2008·4 cites·7 claims
- 3172US7686912B2Method for bonding substrates and method for irradiating particle beam to be utilized thereforAYUMI INDUSTRY CO LTD·Filed 2004·Granted Mar 30, 2010·15 cites·7 claims
- 3272US2025250466A1Method for manufacturing smart card, smart card, and conductive particle-containing hot-melt adhesive sheetDEXERIALS CORP·Filed 2025·Application pending·0 cites
- 3371US10881021B2Loop heat pipe and fabrication method therefor, and electronic deviceFUJITSU LTD·Filed 2018·Granted Dec 29, 2020·1 cites·11 claims
- 3470US8257542B2Multilevel interconnection board and method of fabricating the sameOKAMOTO KEISHIRO·Filed 2009·Granted Sep 4, 2012·1 cites·6 claims
- 3570US8178791B2Wiring substrate including conductive core substrate, and manufacturing method thereofABE TOMOYUKI·Filed 2008·Granted May 15, 2012·4 cites·20 claims
- 3668US7017265B2Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured therebyFUJITSU LTD·Filed 2002·Granted Mar 28, 2006·12 cites·18 claims
- 3767US11536518B2Fabrication method for loop heat pipeFUJITSU LTD·Filed 2020·Granted Dec 27, 2022·0 cites·3 claims
- 3867US8171578B2Water discharge systemTSUJITA MASAMI·Filed 2008·Granted May 8, 2012·10 cites·3 claims
- 3965US12312514B2Method for manufacturing smart cardDEXERIALS CORP·Filed 2021·Granted May 27, 2025·0 cites·11 claims
- 4065US8035037B2Core substrate and method of producing the sameFUJITSU LTD·Filed 2008·Granted Oct 11, 2011·2 cites·10 claims
- 4164US7754536B2Semiconductor device and fabrication process thereofFUJITSU LTD·Filed 2008·Granted Jul 13, 2010·2 cites·3 claims
- 4263US8153908B2Circuit board and method of producing the sameIIDA KENJI·Filed 2008·Granted Apr 10, 2012·2 cites·6 claims
- 4363US8119925B2Core substrate and printed wiring boardYOSHIMURA HIDEAKI·Filed 2009·Granted Feb 21, 2012·2 cites·7 claims
- 4463US7248222B2High-frequency moduleFUJITSU LTD·Filed 2005·Granted Jul 24, 2007·5 cites·10 claims
- 4563US2024279434A1Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2022·Application pending·0 cites
- 4662US7835266B2Node apparatus and maintenance and operation supporting deviceFUJITSU LTD·Filed 2005·Granted Nov 16, 2010·4 cites·2 claims
- 4762US2023287246A1Method for manufacturing joined body, joined body, and hot-melt adhesive sheetDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 4861US12418130B2Connection body and method for manufacturing connection bodyDEXERIALS CORP·Filed 2021·Granted Sep 16, 2025·0 cites·12 claims
- 4959US2009098391A1Core member and method of producing the sameFUJITSU LTD·Filed 2008·Application pending·0 cites
- 5056US2015284602A1Double-sided adhesive tape and method for producing the sameDEXERIALS CORP·Filed 2015·Application pending·0 cites
Showing the top 50 of 74 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →