Inventor · disambiguated record
Toyohiro Aoki
Also filed as: AOKI TOYOHIRO
46 granted patents·6 pending applications·88 citations·filing 2005–2025
97Inventor score
Top patents by PatentIndex Score
52 records- 0198US9859241B1Method of forming a solder bump structureIBM·Filed 2016·Granted Jan 2, 2018·20 cites·13 claims
- 0294US11684988B2Prevention of dripping of material for material injectionIBM·Filed 2022·Granted Jun 27, 2023·1 cites·20 claims
- 0394US11298769B2Prevention of dripping of material for material injectionIBM·Filed 2019·Granted Apr 12, 2022·3 cites·14 claims
- 0493US7250311B2Wirebond crack sensor for low-k dieIBM·Filed 2005·Granted Jul 31, 2007·31 cites·14 claims
- 0592US10615143B2Injection molded solder bumpingIBM·Filed 2018·Granted Apr 7, 2020·3 cites·11 claims
- 0691US10598874B2Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bumpIBM·Filed 2017·Granted Mar 24, 2020·6 cites·15 claims
- 0787US11969828B2Prevention of dripping of material for material injectionIBM·Filed 2023·Granted Apr 30, 2024·0 cites·20 claims
- 0887US10037967B1Injection molded solder bumpingIBM·Filed 2017·Granted Jul 31, 2018·2 cites·20 claims
- 0985US10797011B2Method of forming solder bumpsIBM·Filed 2017·Granted Oct 6, 2020·3 cites·18 claims
- 1085US10741514B2Fabrication of solder balls with injection molded solderIBM·Filed 2019·Granted Aug 11, 2020·2 cites·20 claims
- 1184US11735575B2Bonding of bridge to multiple semiconductor chipsIBM·Filed 2021·Granted Aug 22, 2023·1 cites·16 claims
- 1282US10037958B2Fabrication of solder balls with injection molded solderIBM·Filed 2017·Granted Jul 31, 2018·2 cites·20 claims
- 1382US9837367B1Fabrication of solder balls with injection molded solderIBM·Filed 2016·Granted Dec 5, 2017·2 cites·14 claims
- 1481US11112570B2Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bumpIBM·Filed 2020·Granted Sep 7, 2021·1 cites·20 claims
- 1580US10115692B2Method of forming solder bumpsIBM·Filed 2016·Granted Oct 30, 2018·2 cites·17 claims
- 1680US9508594B2Fabricating pillar solder bumpIBM·Filed 2015·Granted Nov 29, 2016·2 cites·18 claims
- 1778US10991685B2Assembling of chips by stacking with rotationIBM·Filed 2019·Granted Apr 27, 2021·2 cites·25 claims
- 1876US2025062275A1Injection molded solder head with improved sealing performanceIBM·Filed 2024·Application pending·0 cites
- 1975US9586281B2Forming a solder joint between metal layersIBM·Filed 2015·Granted Mar 7, 2017·2 cites·12 claims
- 2074US12142603B2Bonding of bridge to multiple semiconductor chipsIBM·Filed 2023·Granted Nov 12, 2024·0 cites·8 claims
- 2174US12094825B2Interconnection between chips by bridge chipIBM·Filed 2023·Granted Sep 17, 2024·0 cites·25 claims
- 2274US9299606B2Fabricating pillar solder bumpIBM·Filed 2014·Granted Mar 29, 2016·2 cites·14 claims
- 2372US10930609B2Method of forming a solder bump structureIBM·Filed 2020·Granted Feb 23, 2021·0 cites·20 claims
- 2470US10325839B2Reduction of stress in via structureIBM·Filed 2017·Granted Jun 18, 2019·1 cites·18 claims
- 2568US12166008B2Injection molded solder head with improved sealing performanceIBM·Filed 2021·Granted Dec 10, 2024·0 cites·18 claims
- 2668US11181704B2Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bumpIBM·Filed 2020·Granted Nov 23, 2021·0 cites·20 claims
- 2768US2025259905A1Underfill vacuum processIBM·Filed 2025·Application pending·0 cites
- 2867US10424510B2Solder fill into high aspect through holesIBM·Filed 2017·Granted Sep 24, 2019·0 cites·20 claims
- 2966US12315775B2Underfill vacuum processIBM·Filed 2021·Granted May 27, 2025·0 cites·8 claims
- 3065US11848272B2Interconnection between chips by bridge chipIBM·Filed 2021·Granted Dec 19, 2023·0 cites·9 claims
- 3165US10692829B2Method of forming a solder bump structureIBM·Filed 2019·Granted Jun 23, 2020·0 cites·20 claims
- 3263US10388566B2Solder fill into high aspect through holesIBM·Filed 2016·Granted Aug 20, 2019·0 cites·13 claims
- 3362US10607956B2Method of forming a solder bump structureIBM·Filed 2017·Granted Mar 31, 2020·0 cites·18 claims
- 3461US10833035B2Method of forming solder bumpsIBM·Filed 2018·Granted Nov 10, 2020·0 cites·20 claims
- 3561US10566302B2Fabrication of solder balls with injection molded solderIBM·Filed 2018·Granted Feb 18, 2020·0 cites·20 claims
- 3661US10553553B2Method of forming a solder bump structureIBM·Filed 2017·Granted Feb 4, 2020·0 cites·18 claims
- 3760US12456656B2Multichip interconnect packageIBM·Filed 2022·Granted Oct 28, 2025·0 cites·22 claims
- 3860US10103118B2Fabrication of solder balls with injection molded solderIBM·Filed 2017·Granted Oct 16, 2018·0 cites·14 claims
- 3959US12183708B2Double resist structure for electrodeposition bondingIBM·Filed 2022·Granted Dec 31, 2024·0 cites·16 claims
- 4058US12354983B2Fine-pitch joining pad structureIBM·Filed 2022·Granted Jul 8, 2025·0 cites·24 claims
- 4158US10840202B2Method of forming solder bumpsIBM·Filed 2017·Granted Nov 17, 2020·0 cites·20 claims
- 4257US2024282735A1Solder volume for flip-chip bondingIBM·Filed 2023·Application pending·0 cites
- 4356US10593616B2Reduction of stress in via structureTESSERA INC·Filed 2017·Granted Mar 17, 2020·0 cites·20 claims
- 4456US2019214339A1Reduction of stress in via structureIBM·Filed 2019·Application pending·0 cites
- 4554US11164845B2Resist structure for forming bumpsIBM·Filed 2020·Granted Nov 2, 2021·0 cites·24 claims
- 4653US11329018B2Forming of bump structureIBM·Filed 2019·Granted May 10, 2022·0 cites·6 claims
- 4753US2024006371A1Semiconductor device interconnect structureIBM·Filed 2022·Application pending·0 cites
- 4852US10252363B2Forming a solder joint between metal layersIBM·Filed 2017·Granted Apr 9, 2019·0 cites·12 claims
- 4951US10090586B2Wireless communication device with joined semiconductorsIBM·Filed 2017·Granted Oct 2, 2018·0 cites·18 claims
- 5051US2024112965A1Trench structure for semiconductor deviceIBM·Filed 2022·Application pending·0 cites
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →