Inventor · disambiguated record
Toshinobu Banjo
Also filed as: BANJO TOSHINOBU
25 granted patents·796 citations·filing 1986–2006
97Inventor score
Top patents by PatentIndex Score
25 records- 0198US4905124AIC cardMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Feb 27, 1990·161 cites·5 claims
- 0297USD305886SMemory card for a computer systemMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Feb 6, 1990·69 cites·1 claims
- 0390US4842966ABattery holder mechanismMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jun 27, 1989·68 cites·9 claims
- 0485US4838804AMechanism for connecting IC card and external deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jun 13, 1989·51 cites·12 claims
- 0577US5445677AApparatus for manufacturing semiconductor and method of manufacturing semiconductorMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Aug 29, 1995·69 cites·13 claims
- 0677US4864116AMechanism for connecting an IC card to an external deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Sep 5, 1989·37 cites·9 claims
- 0775US5288698AMethod of positioning lead frame on molding die to seal semiconductor element with resinMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Feb 22, 1994·50 cites·9 claims
- 0867US4908178AMethod of molding a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Mar 13, 1990·24 cites·4 claims
- 0966US4868714AIC card including enclosed sliding shutterMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Sep 19, 1989·26 cites·2 claims
- 1064US4818204AMold for molding semiconductor devicesNAKAGAWA OSAMU·Filed 1986·Granted Apr 4, 1989·24 cites·6 claims
- 1163US5123823AMolding device for sealing semiconductor element with resinMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jun 23, 1992·31 cites·11 claims
- 1263US4890197AMemory card housingMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Dec 26, 1989·24 cites·5 claims
- 1361US4789347AMemory cardMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Dec 6, 1988·21 cites·5 claims
- 1460US4926034AConnector in external device for connection to IC cardMITSUBISHI ELECTRIC CORP·Filed 1988·Granted May 15, 1990·20 cites·3 claims
- 1556US5177992ADevice for feeding thin-web frameMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jan 12, 1993·11 cites·8 claims
- 1655US4857989ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Aug 15, 1989·21 cites·10 claims
- 1749US4868074ABattery holder mechanismMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Sep 19, 1989·13 cites·12 claims
- 1849US4839713APackage structure for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jun 13, 1989·17 cites·4 claims
- 1946US4984062APackaged semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jan 8, 1991·15 cites·5 claims
- 2046US4868713AMemory card housing a smiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Sep 19, 1989·11 cites·5 claims
- 2142US7390188B2Resin molding apparatusTOWA CORP·Filed 2006·Granted Jun 24, 2008·0 cites·2 claims
- 2241US4933540AIC cardMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jun 12, 1990·8 cites·2 claims
- 2339US5246513ADie bonding apparatus and method of controlling the sameMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Sep 21, 1993·10 cites·7 claims
- 2439US4878610ADie bonding apparatusMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Nov 7, 1989·10 cites·9 claims
- 2535US4924077AMemory cardMITSUBISHI ELECTRIC CORP·Filed 1988·Granted May 8, 1990·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →