Inventor · disambiguated record
Tomoharu Fujii
Also filed as: FUJII TOMOHARU
44 granted patents·11 pending applications·244 citations·filing 2000–2022
97Inventor score
Top patents by PatentIndex Score
55 records- 0195US7782624B2Electronic apparatusSHINKO ELECTRIC IND CO·Filed 2008·Granted Aug 24, 2010·35 cites·8 claims
- 0294US9080612B2Driving force transmission deviceFUJII TOMOHARU·Filed 2011·Granted Jul 14, 2015·12 cites·5 claims
- 0388US8729680B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2012·Granted May 20, 2014·11 cites·4 claims
- 0487US7841076B2Manufacturing method of wiring substrate and manufacturing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Nov 30, 2010·20 cites·10 claims
- 0586US9336938B2Wiring substrate and method for manufacturing the wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted May 10, 2016·6 cites·25 claims
- 0686US8592959B2Semiconductor device mounted on a wiring board having a capFUJII TOMOHARU·Filed 2010·Granted Nov 26, 2013·9 cites·10 claims
- 0784US8552815B2High-frequency line structure for impedance matching a microstrip line to a resin substrate and method of makingFUJII TOMOHARU·Filed 2010·Granted Oct 8, 2013·8 cites·6 claims
- 0883US8373997B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2010·Granted Feb 12, 2013·7 cites·9 claims
- 0981US6380614B1Non-contact type IC card and process for manufacturing sameSHINKO ELECTRIC IND CO·Filed 2000·Granted Apr 30, 2002·35 cites·9 claims
- 1080US7468698B2Patch antenna, array antenna, and mounting board having the sameSHINKO ELECTRIC IND CO·Filed 2005·Granted Dec 23, 2008·12 cites·10 claims
- 1178US7796085B2Antenna and wiring boardSHINKO ELECTRIC IND CO·Filed 2006·Granted Sep 14, 2010·7 cites·5 claims
- 1278US7678612B2Method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 16, 2010·8 cites·8 claims
- 1377US9224684B2Wiring board and method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2014·Granted Dec 29, 2015·4 cites·7 claims
- 1477US8035192B2Semiconductor device and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2008·Granted Oct 11, 2011·7 cites·9 claims
- 1575US8836138B2Wiring substrate and semiconductor packageFUJII TOMOHARU·Filed 2012·Granted Sep 16, 2014·4 cites·5 claims
- 1674US9560759B2Power supply module, package for the power supply module, method of manufacturing the power supply module and wireless sensor moduleSHINKO ELECTRIC IND CO·Filed 2015·Granted Jan 31, 2017·2 cites·10 claims
- 1773US6591494B2Method for manufacturing a non-contact type IC cardSHINKO ELECTRIC IND CO·Filed 2001·Granted Jul 15, 2003·16 cites·6 claims
- 1870US6552694B1Semiconductor device and fabrication method thereofSHINKO ELECTRIC IND CO·Filed 2000·Granted Apr 22, 2003·15 cites·20 claims
- 1969US9970487B2Damper deviceNISSAN MOTOR·Filed 2013·Granted May 15, 2018·3 cites·6 claims
- 2069US8094457B2Electronic apparatusFUJII TOMOHARU·Filed 2007·Granted Jan 10, 2012·4 cites·16 claims
- 2167US9391052B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2014·Granted Jul 12, 2016·2 cites·15 claims
- 2267US8786099B2Wiring substrate and semiconductor packageFUJII TOMOHARU·Filed 2012·Granted Jul 22, 2014·2 cites·5 claims
- 2367US7569924B2Semiconductor device and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2006·Granted Aug 4, 2009·3 cites·5 claims
- 2465US9347501B2Drive power transmission systemNISSAN MOTOR·Filed 2012·Granted May 24, 2016·2 cites·16 claims
- 2560US11495885B2Sensor moduleSHINKO ELECTRIC IND CO·Filed 2021·Granted Nov 8, 2022·0 cites·13 claims
- 2659US9926984B2Damper deviceNISSAN MOTOR·Filed 2013·Granted Mar 27, 2018·1 cites·6 claims
- 2759US8405953B2Capacitor-embedded substrate and method of manufacturing the sameFUJII TOMOHARU·Filed 2008·Granted Mar 26, 2013·2 cites·1 claims
- 2856US7791446B2Inductor device and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Sep 7, 2010·1 cites·3 claims
- 2955US8018392B2Antenna element and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Granted Sep 13, 2011·2 cites·4 claims
- 3052US11343915B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2020·Granted May 24, 2022·0 cites·11 claims
- 3152US9399825B2Wiring board and method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2014·Granted Jul 26, 2016·0 cites·17 claims
- 3252US2022401837A1Program and information processing apparatus that provide game to playerANIPLEX INC·Filed 2022·Application pending·0 cites
- 3351US10074470B2Passive device substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Sep 11, 2018·0 cites·8 claims
- 3450US9777376B2Film-forming apparatusULVAC INC·Filed 2014·Granted Oct 3, 2017·0 cites·6 claims
- 3550US2010009082A1Roll-to-roll vacuum deposition apparatusULVAC INC·Filed 2007·Application pending·0 cites
- 3649US8053677B2Electronic apparatus and method of manufacturing the same, and wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2008·Granted Nov 8, 2011·0 cites·11 claims
- 3748US10791623B2Electronic device and electronic moduleSHINKO ELECTRIC IND CO·Filed 2018·Granted Sep 29, 2020·0 cites·8 claims
- 3847US9214422B2Semiconductor apparatus having signal and ground terminals arranged on vertically adjacent wiring substratesSHINKO ELECTRIC IND CO·Filed 2014·Granted Dec 15, 2015·0 cites·10 claims
- 3947US7542006B2Wiring board and semiconductor apparatusSHINKO ELECTRIC IND CO·Filed 2007·Granted Jun 2, 2009·0 cites·6 claims
- 4047US2009267221A1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 4147US2009121334A1Manufacturing method of semiconductor apparatus and semiconductor apparatusSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 4246US7728283B2Illuminance detecting apparatus comprising a light shielding element containing openings for each detector elementSHINKO ELECTRIC IND CO·Filed 2008·Granted Jun 1, 2010·0 cites·18 claims
- 4346US2008217515A1Illuminance detection apparatus and sensor moduleSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 4445US6556175B2Non-contact type IC card, antenna and antenna frame for IC cardSHINKO ELECTRIC IND CO·Filed 2001·Granted Apr 29, 2003·4 cites·15 claims
- 4545US2009029506A1Method of manufacturing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 4643US2007029667A1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Application pending·0 cites
- 4743US2007086145A1Capacitor-built-in substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Application pending·0 cites
- 4843US2007029656A1Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Application pending·0 cites
- 4941US10219745B2Sensor including a peelable insulation sheetNIHON KOHDEN CORP·Filed 2016·Granted Mar 5, 2019·0 cites·18 claims
- 5041US2007275655A1Terminal for relaying data signalSHINKO ELECTRIC IND CO·Filed 2007·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →