Inventor · disambiguated record
Toshikazu Hanawa
Also filed as: HANAWA TOSHIKAZU
10 granted patents·3 pending applications·1 citations·filing 2016–2019
78Inventor score
Files withRENESAS ELECTRONICS CORP13
Top patents by PatentIndex Score
13 records- 0166US9761685B2Manufacturing method for semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Sep 12, 2017·1 cites·19 claims
- 0252US11594489B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Feb 28, 2023·0 cites·11 claims
- 0352US10872813B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Dec 22, 2020·0 cites·5 claims
- 0451US10224214B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Mar 5, 2019·0 cites·5 claims
- 0551US9935023B2Methods for manufacturing semiconductor device and for detecting end point of dry etchingRENESAS ELECTRONICS CORP·Filed 2017·Granted Apr 3, 2018·0 cites·15 claims
- 0650US10043884B2Manufacturing method for semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Aug 7, 2018·0 cites·20 claims
- 0749US9818620B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 14, 2017·0 cites·9 claims
- 0849US9666445B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted May 30, 2017·0 cites·17 claims
- 0948US9711423B2Methods for manufacturing semiconductor device and for detecting end point of dry etchingRENESAS ELECTRONICS CORP·Filed 2016·Granted Jul 18, 2017·0 cites·14 claims
- 1045US2019043756A1Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 1144US2018061769A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
- 1238US9595468B2Method of manufacturing semiconductor device that uses treatment to enhance hydrophilicity of spin coated insulating filmRENESAS ELECTRONICS CORP·Filed 2016·Granted Mar 14, 2017·0 cites·9 claims
- 1333US2017287722A1Manufacturing method of semiconductor device and maintenance method of dry etching equipmentRENESAS ELECTRONICS CORP·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Toshikazu Hanawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →