Inventor · disambiguated record
Toshihiko Hayashi
Also filed as: HAYASHI TOSHIHIKO
43 granted patents·12 pending applications·248 citations·filing 1974–2024
98Inventor score
Top patents by PatentIndex Score
55 records- 0196US11778840B2Solid-state imaging element and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Granted Oct 3, 2023·2 cites·20 claims
- 0296US8669602B2Solid-state imaging device, manufacturing method thereof, and electronic apparatusHAYASHI TOSHIHIKO·Filed 2012·Granted Mar 11, 2014·42 cites·22 claims
- 0395US9496307B2Solid-state imaging device, manufacturing method thereof, and electronic apparatusSONY CORP·Filed 2015·Granted Nov 15, 2016·9 cites·19 claims
- 0495US9171875B2Solid-state imaging device, manufacturing method thereof, and electronic apparatusSONY CORP·Filed 2014·Granted Oct 27, 2015·15 cites·19 claims
- 0592US10600838B2Semiconductor device and method of manufacturing thereofSONY CORP·Filed 2015·Granted Mar 24, 2020·8 cites·15 claims
- 0692US9911779B2Solid-state imaging device, manufacturing method thereof, and electronic apparatusSONY CORP·Filed 2016·Granted Mar 6, 2018·6 cites·20 claims
- 0790US11539011B2Solid-state imaging element and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Dec 27, 2022·3 cites·20 claims
- 0890US10121814B2Solid-state imaging device, manufacturing method thereof, and electronic apparatusSONY CORP·Filed 2018·Granted Nov 6, 2018·4 cites·20 claims
- 0989US10622399B2Solid-state imaging device, manufacturing method thereof, and electronic apparatusSONY CORP·Filed 2018·Granted Apr 14, 2020·3 cites·19 claims
- 1089US9666628B2Solid-state imaging device and method for manufacturing the sameSONY CORP·Filed 2015·Granted May 30, 2017·5 cites·8 claims
- 1186US8853852B2Semiconductor apparatus and electronic equipmentSONY CORP·Filed 2012·Granted Oct 7, 2014·8 cites·6 claims
- 1285US11476291B2Semiconductor device and method of manufacturing thereofSONY CORP·Filed 2019·Granted Oct 18, 2022·3 cites·26 claims
- 1385US8373786B2Solid-state imaging device, manufacturing method thereof, and electronic deviceSONY CORP·Filed 2009·Granted Feb 12, 2013·7 cites·22 claims
- 1484US9082898B2Solid-state imaging device and method for manufacturing the sameSONY CORP·Filed 2013·Granted Jul 14, 2015·2 cites·9 claims
- 1583US12213326B2Solid-state imaging element and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Granted Jan 28, 2025·0 cites·23 claims
- 1683US11641750B2Image pickup element, stacked image pickup element, and solid image pickup apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted May 2, 2023·2 cites·23 claims
- 1782US8564033B2Solid-state imaging device and method for manufacturing the sameHAYASHI TOSHIHIKO·Filed 2008·Granted Oct 22, 2013·5 cites·20 claims
- 1880US10431618B2Stacked lens structure method of manufacturing the same, and electronic apparatusSONY CORP·Filed 2016·Granted Oct 1, 2019·1 cites·38 claims
- 1980US8410569B2Solid-state imaging device and method for producing the sameYOSHIHARA IKUO·Filed 2010·Granted Apr 2, 2013·3 cites·5 claims
- 2080US7612452B2Method for manufacturing a semiconductor device and semiconductor deviceSONY CORP·Filed 2007·Granted Nov 3, 2009·12 cites·11 claims
- 2179US11543621B2AF module, camera module, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Jan 3, 2023·2 cites·10 claims
- 2277US11798971B2Solid-state imaging device, manufacturing method thereof, and electronic apparatusSONY GROUP CORP·Filed 2021·Granted Oct 24, 2023·0 cites·17 claims
- 2375US10930695B2Semiconductor device and method of manufacturing the sameSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Feb 23, 2021·2 cites·20 claims
- 2474US10818717B2Stacked lens structure, method of manufacturing the same, and electronic apparatusSONY CORP·Filed 2019·Granted Oct 27, 2020·0 cites·20 claims
- 2573US11164904B2Solid-state imaging device, manufacturing method thereof, and electronic apparatusSONY GROUP CORP·Filed 2020·Granted Nov 2, 2021·0 cites·20 claims
- 2672US12156412B2Image pickup element, stacked image pickup element, and solid image pickup apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Granted Nov 26, 2024·0 cites·21 claims
- 2772US2025008751A1Image pickup element, stacked image pickup element, and solid image pickup apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2024·Application pending·0 cites
- 2871US3972465AApparatus for and method of friction weldingTOYODA JIDOSHOKKI SAKUSHO KK·Filed 1974·Granted Aug 3, 1976·25 cites·6 claims
- 2970US11342371B2Stacked lens structure, method of manufacturing the same, and electronic apparatusSONY CORP·Filed 2020·Granted May 24, 2022·0 cites·17 claims
- 3070US2023005979A1Semiconductor device and method of manufacturing thereofSONY GROUP CORP·Filed 2022·Application pending·0 cites
- 3166US2013207215A1Solid-state imaging device, manufacturing method thereof, and electronic deviceSONY CORP·Filed 2013·Application pending·0 cites
- 3265US11484963B2Fitting member, annular member, joined member and method of manufacturing joined memberORIGIN CO LTD·Filed 2019·Granted Nov 1, 2022·1 cites·5 claims
- 3364US11848346B2Semiconductor device and method of manufacturing the sameSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Dec 19, 2023·0 cites·20 claims
- 3464US10847559B2Solid-state image sensor and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Nov 24, 2020·1 cites·7 claims
- 3564US7781798B2Solid-state image pickup device and fabrication method thereforSONY CORP·Filed 2008·Granted Aug 24, 2010·1 cites·7 claims
- 3662US11731217B2Method and device for manufacturing joining apparatusORIGIN CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·5 claims
- 3761US5750223APolyamideimide inner surface-coated metal containerTOYO SEIKAN KAISHA LTD·Filed 1996·Granted May 12, 1998·20 cites·9 claims
- 3861US2025205837A1Insert manufacturing apparatus, method of manufacturing insert, insert for cutting tool, and baseORIGIN CO LTD·Filed 2023·Application pending·0 cites
- 3960US4428494AEasily-openable heat seal lidTOYO SEIKAN KAISHA LTD·Filed 1982·Granted Jan 31, 1984·26 cites·5 claims
- 4056US10369654B2Welded article and method for manufacturing welded articleORIGIN CO LTD·Filed 2016·Granted Aug 6, 2019·0 cites·6 claims
- 4156US2023080587A1Joining device and method for manufacturing joined objectORIGIN CO LTD·Filed 2021·Application pending·0 cites
- 4255US12464829B2Imaging element and imaging deviceSONY GROUP CORP·Filed 2021·Granted Nov 4, 2025·0 cites·46 claims
- 4355US2019299323A1Welded article and method for manufacturing welded articleORIGIN ELECTRIC·Filed 2019·Application pending·0 cites
- 4455US2024407184A1Light detection device, method of manufacturing the same, electronic equipment, and mobile bodySONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 4554US4984350AProcess of installing a resonator for an automobileNISSAN MOTOR·Filed 1989·Granted Jan 15, 1991·13 cites·8 claims
- 4653US2025006764A1Light detecting device and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 4746US2017105363A1Solar light type glass greenhouseASAHI GLASS CO LTD·Filed 2016·Application pending·0 cites
- 4842US12439181B2Light detection apparatus, light detection system, electronic equipment, and mobile bodySONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Oct 7, 2025·0 cites·27 claims
- 4942US10622563B2Semiconductor device, solid-state imaging device, electronic apparatus, and manufacturing method of semiconductor deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Apr 14, 2020·0 cites·19 claims
- 5040US2008173547A1Method of manufacturing semiconductor deviceSONY CORP·Filed 2007·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →