Inventor · disambiguated record
Tomoko Higashino
Also filed as: HIGASHINO TOMOKO
13 granted patents·6 pending applications·141 citations·filing 1999–2018
92Inventor score
Technology areasH10W
Files withRENESAS ELECTRONICS CORP7RENESAS TECH CORP6ABE YOSHIYUKI2HIGASHINO TOMOKO1HITACHI CHEMICAL CO LTD1
Top patents by PatentIndex Score
19 records- 0195US7892949B2Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting regionRENESAS ELECTRONICS CORP·Filed 2006·Granted Feb 22, 2011·31 cites·5 claims
- 0283US7563642B2Manufacturing method of a semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Jul 21, 2009·12 cites·14 claims
- 0382US8084334B2Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting regionABE YOSHIYUKI·Filed 2011·Granted Dec 27, 2011·4 cites·5 claims
- 0481US10002808B2Semiconductor device manufacturing method and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Jun 19, 2018·2 cites·19 claims
- 0578US6750080B2Semiconductor device and process for manufacturing the sameRENESAS TECH CORP·Filed 2003·Granted Jun 15, 2004·24 cites·9 claims
- 0677US7514294B2Semiconductor device and a manufacturing method of the sameRENESAS TECH CORP·Filed 2006·Granted Apr 7, 2009·5 cites·6 claims
- 0772US6916686B2Method of manufacturing a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2003·Granted Jul 12, 2005·20 cites·17 claims
- 0869US9070560B2Semiconductor chip with modified regions for dividing the chipRENESAS ELECTRONICS CORP·Filed 2014·Granted Jun 30, 2015·1 cites·18 claims
- 0968US7148081B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Dec 12, 2006·14 cites·9 claims
- 1060US2018277456A1Semiconductor device manufacturing method and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 1155US6552437B1Semiconductor device and method of manufacture thereofHITACHI LTD·Filed 1999·Granted Apr 22, 2003·18 cites·28 claims
- 1255US2009191667A1semiconductor device and a manufacturing method of the sameRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 1354US2015235973A1Semiconductor device manufacturing method and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 1454US2013143359A1Semiconductor device and a manufacturing method of the sameRENESAS ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1552US8772135B2Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereofABE YOSHIYUKI·Filed 2011·Granted Jul 8, 2014·0 cites·14 claims
- 1649US2010213594A1Semiconductor device and a manufacturing method of the sameRENESAS TECH CORP·Filed 2010·Application pending·0 cites
- 1743US2007114672A1Semiconductor device and method of manufacturing the sameHIGASHINO TOMOKO·Filed 2006·Application pending·0 cites
- 1840US9006036B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Apr 14, 2015·0 cites·14 claims
- 1940US6445076B1Insulating adhesive for electronic parts, and lead frame and semiconductor device using the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Sep 3, 2002·10 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →