Inventor · disambiguated record
Toyokazu Hotchi
Also filed as: HOTCHI TOYOKAZU
6 granted patents·1 pending application·7 citations·filing 2014–2018
71Inventor score
Files withNAMICS CORP7
Top patents by PatentIndex Score
7 records- 0178US10023775B2Film adhesive and semiconductor device including the sameNAMICS CORP·Filed 2016·Granted Jul 17, 2018·4 cites·17 claims
- 0261US11315846B2Semiconductor deviceNAMICS CORP·Filed 2018·Granted Apr 26, 2022·1 cites·7 claims
- 0360US9417228B2Method of predicting viscosity behavior of thermosetting resin, simulation software, method of producing thermosetting resin, and underfill produced in the production methodNAMICS CORP·Filed 2014·Granted Aug 16, 2016·2 cites·8 claims
- 0439US10738187B2Resin composition and semiconductor deviceNAMICS CORP·Filed 2017·Granted Aug 11, 2020·0 cites·9 claims
- 0539US2020001011A1Prefilled syringe and preservation method for resin compositeNAMICS CORP·Filed 2018·Application pending·0 cites
- 0634US11485848B2NCF for pressure mounting, cured product thereof, and semiconductor device including sameNAMICS CORP·Filed 2018·Granted Nov 1, 2022·0 cites·6 claims
- 0728US10388583B2Thermosetting resin composition and method of producing sameNAMICS CORP·Filed 2015·Granted Aug 20, 2019·0 cites·7 claims
Join the waitlist — get patent alerts
Get an alert when Toyokazu Hotchi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →