Inventor · disambiguated record
Tomoo Iijima
Also filed as: IIJIMA TOMOO
20 granted patents·9 pending applications·549 citations·filing 1995–2016
96Inventor score
Top patents by PatentIndex Score
29 records- 0198US6528874B1Wiring circuit substrate and manufacturing method thereofNORTH CORP·Filed 2000·Granted Mar 4, 2003·120 cites·24 claims
- 0295US6646337B2Wiring circuit substrate and manufacturing method thereforNORTH CORP·Filed 2002·Granted Nov 11, 2003·50 cites·25 claims
- 0391US6828221B2Manufacturing method for wiring circuit substratesNORTH CORP·Filed 2002·Granted Dec 7, 2004·37 cites·4 claims
- 0489US6782610B1Method for fabricating a wiring substrate by electroplating a wiring film on a metal baseNORTH CORP·Filed 1999·Granted Aug 31, 2004·141 cites·4 claims
- 0588US6884709B2Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrateNORTH CORP·Filed 2003·Granted Apr 26, 2005·50 cites·4 claims
- 0687US10128720B2Electric motor and electric pumpMITSUBA CORP·Filed 2013·Granted Nov 13, 2018·9 cites·17 claims
- 0786US7238603B2Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrateTESSERA INTERCONNECT MATERIALS·Filed 2005·Granted Jul 3, 2007·13 cites·8 claims
- 0883US6617236B2Fabrication method of wiring substrate for mounting semiconductor element and semiconductor deviceSONY CORP·Filed 2002·Granted Sep 9, 2003·32 cites·7 claims
- 0981US7721422B2Methods of making microelectronic assembliesTESSERA INTERCONNECT MATERIALS·Filed 2007·Granted May 25, 2010·7 cites·20 claims
- 1081US7546681B2Manufacturing method for wiring circuit substrateTESSERA INTERCONNECT MATERIALS·Filed 2006·Granted Jun 16, 2009·6 cites·13 claims
- 1181US7342802B2Multilayer wiring board for an electronic deviceTESSERA INTERCONNECT MATERIALS·Filed 2004·Granted Mar 11, 2008·20 cites·26 claims
- 1279US7096578B2Manufacturing method for wiring circuit substrateTESSERA INTERCONNECT MATERIALS·Filed 2004·Granted Aug 29, 2006·15 cites·14 claims
- 1369US6372620B1Fabrication method of wiring substrate for mounting semiconductor element and semiconductor deviceSONY CORP·Filed 1999·Granted Apr 16, 2002·34 cites·7 claims
- 1466US10270321B2Electric motorMITSUBA CORP·Filed 2015·Granted Apr 23, 2019·1 cites·8 claims
- 1558US10104785B2Multilayer wiring board for an electronic deviceINVENSAS CORP·Filed 2016·Granted Oct 16, 2018·0 cites·20 claims
- 1658US9521755B2Multilayer wiring board for an electronic deviceINVENSAS CORP·Filed 2014·Granted Dec 13, 2016·0 cites·19 claims
- 1756US2013247372A1Multilayer wiring board for an electronic deviceINVENSAS CORP·Filed 2013·Application pending·0 cites
- 1853US2008296254A1Multilayer wiring board for an electronic deviceTESSERA INTERCONNECT MATERIALS·Filed 2008·Application pending·0 cites
- 1952US7505281B2Multilayer wiring board for an electronic deviceTESSERA INTERCONNECT MATERIALS·Filed 2007·Granted Mar 17, 2009·0 cites·21 claims
- 2050US2010242270A1Wiring circuit board, manufacturing method for the wiring circuit board, and circuit moduleIIJIMA TOMOO·Filed 2010·Application pending·0 cites
- 2142US2004201096A1Wiring circuit board, manufacturing method for the wiring circuit board, and circuit moduleFiled 2004·Application pending·0 cites
- 2241US2005224256A1Interlayer member used for producing multilayer wiring board and method of producing the sameNORTH CORP·Filed 2005·Application pending·0 cites
- 2339US2007170598A1Flexible circuit board, method for making the same, flexible multi-layer wiring circuit board, and method for making the sameSONY CHEMICALS CORP·Filed 2004·Application pending·0 cites
- 2438US2008136041A1Structure and method of making interconnect element having metal traces embedded in surface of dielectricTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 2536US8112881B2Method for manufacturing multilayer wiring boardSHIMIZU KAZUHIRO·Filed 2005·Granted Feb 14, 2012·0 cites·9 claims
- 2634US5613345AWaste disposing system and apparatusCATTLEYA MUSIC CO LTD·Filed 1995·Granted Mar 25, 1997·14 cites·13 claims
- 2733US2008169568A1Structure and method of making interconnect element having metal traces embedded in surface of dielectricTESSERA INTERCONNECT MATERIALS·Filed 2007·Application pending·0 cites
- 2832US2005097727A1Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring boardFiled 2002·Application pending·0 cites
- 2931US8736064B2Structure and method of making interconnect element having metal traces embedded in surface of dielectricKOTAKE HIDEKI·Filed 2010·Granted May 27, 2014·0 cites·25 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →