Inventor · disambiguated record
Toshifumi Inamasu
Also filed as: INAMASU TOSHIFUMI
13 granted patents·99 citations·filing 2006–2022
89Inventor score
Top patents by PatentIndex Score
13 records- 0193US11348791B2Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2020·Granted May 31, 2022·3 cites·2 claims
- 0293US7908995B2Stage apparatus and application processing apparatusTOKYO ELECTRON LTD·Filed 2006·Granted Mar 22, 2011·43 cites·19 claims
- 0393US7905195B2Floating-type substrate conveying and processing apparatusTOKYO ELECTRON LTD·Filed 2006·Granted Mar 15, 2011·34 cites·5 claims
- 0483US10340248B2Bonding systemsTOKYO ELECTRON LTD·Filed 2017·Granted Jul 2, 2019·4 cites·10 claims
- 0579US11094667B2Bonding apparatus, bonding system, bonding method, and recording mediumTOKYO ELECTRON LTD·Filed 2017·Granted Aug 17, 2021·3 cites·9 claims
- 0679US9468946B2Wiping pad, and nozzle maintenance apparatus and coating treatment apparatus using wiping padTOKYO ELECTRON LTD·Filed 2013·Granted Oct 18, 2016·5 cites·13 claims
- 0775US10373847B2Bonding apparatusTOKYO ELECTRON LTD·Filed 2017·Granted Aug 6, 2019·2 cites·7 claims
- 0869US12381083B2Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2022·Granted Aug 5, 2025·0 cites·12 claims
- 0967US8307778B2Coating method and coating unitINAMASU TOSHIFUMI·Filed 2007·Granted Nov 13, 2012·5 cites·20 claims
- 1060US11658146B2Bonding apparatus, bonding system, bonding method, and recording mediumTOKYO ELECTRON LTD·Filed 2021·Granted May 23, 2023·0 cites·11 claims
- 1155US11545383B2Substrate positioning apparatus, substrate positioning method, and bonding apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jan 3, 2023·0 cites·8 claims
- 1251US12308294B2Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2022·Granted May 20, 2025·0 cites·12 claims
- 1348US11804466B2Substrate processing apparatus, substrate processing method and bonding methodTOKYO ELECTRON LTD·Filed 2020·Granted Oct 31, 2023·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →