Inventor · disambiguated record
Toshiyuki Inaoka
Also filed as: INAOKA TOSHIYUKI
3 granted patents·1 pending application·2 citations·filing 2014–2018
51Inventor score
Top patents by PatentIndex Score
4 records- 0168US10079161B2Method for producing a semiconductor packageJ DEVICES CORP·Filed 2018·Granted Sep 18, 2018·2 cites·5 claims
- 0252US9717142B2Multilayer wiring substrate, method of producing the same, and semiconductor productSONY CORP·Filed 2014·Granted Jul 25, 2017·0 cites·6 claims
- 0340US2017373012A1Semiconductor package and method for producing sameJ-DEVICES CORP·Filed 2017·Application pending·0 cites
- 0434US10096564B2Manufacturing method of semiconductor packageJ DEVICES CORP·Filed 2017·Granted Oct 9, 2018·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →