Inventor · disambiguated record
Tomoyuki Ishimatsu
Also filed as: ISHIMATSU TOMOYUKI
34 granted patents·4 pending applications·125 citations·filing 1999–2020
95Inventor score
Top patents by PatentIndex Score
38 records- 0185US8395052B2Conductive particle, anisotropic conductive film, joined structure, and joining methodISHIMATSU TOMOYUKI·Filed 2010·Granted Mar 12, 2013·8 cites·16 claims
- 0281US8932716B2Conductive particle, and anisotropic conductive film, bonded structure, and bonding methodISHIMATSU TOMOYUKI·Filed 2011·Granted Jan 13, 2015·3 cites·13 claims
- 0381US8796557B2Adhesive film, connecting method, and joined structureISHIMATSU TOMOYUKI·Filed 2009·Granted Aug 5, 2014·5 cites·19 claims
- 0480US6344156B1Anisotropic conductive adhesive filmSONY CHEMICALS CORP·Filed 1999·Granted Feb 5, 2002·63 cites·15 claims
- 0579US10199358B2Multilayer substrateDEXERIALS CORP·Filed 2016·Granted Feb 5, 2019·3 cites·12 claims
- 0676US10350872B2Method for manufacturing anisotropically conductive film, anisotropically conductive film, and conductive structureDEXERIALS CORP·Filed 2013·Granted Jul 16, 2019·3 cites·12 claims
- 0776US6827880B2Anisotropic conductive adhesiveSONY CHEMICALS CORP·Filed 2001·Granted Dec 7, 2004·12 cites·12 claims
- 0875US10566108B2Anisotropic electrically conductive film, method for producing same, and connection structural bodyDEXERIALS CORP·Filed 2019·Granted Feb 18, 2020·0 cites·25 claims
- 0974US10589502B2Anisotropic conductive film, connected structure, and method for manufacturing a connected structureDEXERIALS CORP·Filed 2019·Granted Mar 17, 2020·1 cites·14 claims
- 1071US10312125B2Protective tape and method for manufacturing semiconductor device using the sameDEXERIALS CORP·Filed 2016·Granted Jun 4, 2019·1 cites·20 claims
- 1171US9741598B2Protective tape and method for manufacturing a semiconductor device using the sameDEXERIALS CORP·Filed 2014·Granted Aug 22, 2017·3 cites·9 claims
- 1269US6527984B1Low temperature-curable connecting material for anisotropically electroconductive connectionSONY CHEMICALS CORP·Filed 2000·Granted Mar 4, 2003·13 cites·12 claims
- 1367US10832830B2Anisotropic electrically conductive film, method for producing same, and connection structural bodyDEXERIALS CORP·Filed 2020·Granted Nov 10, 2020·0 cites·28 claims
- 1466USRE41784EAdhesive materialSONY CORP·Filed 2007·Granted Sep 28, 2010·0 cites·6 claims
- 1565US8309638B2Connecting film, and joined structure and method for producing the sameISHIMATSU TOMOYUKI·Filed 2011·Granted Nov 13, 2012·2 cites·4 claims
- 1664US8273207B2Method for connecting electronic part and joined structureISHIMATSU TOMOYUKI·Filed 2009·Granted Sep 25, 2012·3 cites·6 claims
- 1763US8980043B2Anisotropic conductive film, joined structure and method for producing the joined structureISHIMATSU TOMOYUKI·Filed 2012·Granted Mar 17, 2015·0 cites·4 claims
- 1862US8247697B2Anisotropic conductive film, joined structure and method for producing the joined structureISHIMATSU TOMOYUKI·Filed 2009·Granted Aug 21, 2012·2 cites·9 claims
- 1958US8524032B2Connecting film, and joined structure and method for producing the sameAKUTSU YASUSHI·Filed 2012·Granted Sep 3, 2013·0 cites·2 claims
- 2057US9023464B2Connecting film, and joined structure and method for producing the sameAKUTSU YASUSHI·Filed 2010·Granted May 5, 2015·1 cites·12 claims
- 2157US2011120767A1Anisotropic electrically conductive film and method for manufacturing connection assembly using the sameSONY CHEM & INF DEVICE CORP·Filed 2008·Application pending·0 cites
- 2254US9253911B2Anisotropic conductive material and method for manufacturing sameTSUKAO REIJI·Filed 2011·Granted Feb 2, 2016·1 cites·7 claims
- 2353US10442958B2Anisotropic conductive film and production method of the sameDEXERIALS CORP·Filed 2015·Granted Oct 15, 2019·0 cites·19 claims
- 2453US10304587B2Anisotropic electrically conductive film, method for producing same, and connection structural bodyDEXERIALS CORP·Filed 2015·Granted May 28, 2019·0 cites·35 claims
- 2550US6777478B2Adhesive materialSONY CHEMICALS CORP·Filed 2001·Granted Aug 17, 2004·0 cites·6 claims
- 2648US9924599B2Anisotropic conductive film, anisotropic conductive film production method, connecting method, and bonded structureDEXERIALS CORP·Filed 2014·Granted Mar 20, 2018·0 cites·16 claims
- 2748US8330052B2Joined structure and method for producing the sameISHIMATSU TOMOYUKI·Filed 2011·Granted Dec 11, 2012·0 cites·6 claims
- 2843US11402408B2Electrical characteristics inspection toolDEXERIALS CORP·Filed 2018·Granted Aug 2, 2022·0 cites·17 claims
- 2942US8987607B2Conductive particle, and anisotropic conductive film, bonded structure, and bonding methodOZEKI HIROKI·Filed 2012·Granted Mar 24, 2015·1 cites·20 claims
- 3042US8158887B2Adhesive film, connecting method, and joined structureISHIMATSU TOMOYUKI·Filed 2010·Granted Apr 17, 2012·0 cites·6 claims
- 3141US10943879B2Bump-forming film, semiconductor device and manufacturing method thereof, and connection structureDEXERIALS CORP·Filed 2016·Granted Mar 9, 2021·0 cites·18 claims
- 3240US10273386B2Thermosetting adhesive sheet and semiconductor device manufacturing methodDEXERIALS CORP·Filed 2016·Granted Apr 30, 2019·0 cites·13 claims
- 3340US2013077266A1Connection method and connection structure of electronic componentTSUKAO REIJI·Filed 2011·Application pending·0 cites
- 3439US11901325B2Multilayer substrateDEXERIALS CORP·Filed 2016·Granted Feb 13, 2024·0 cites·20 claims
- 3539US10575410B2Anisotropic conductive film, manufacturing method thereof, and connection structureDEXERIALS CORP·Filed 2016·Granted Feb 25, 2020·0 cites·3 claims
- 3638US11624011B2Thermosetting adhesive sheet and semiconductor device manufacturing methodDEXERIALS CORP·Filed 2016·Granted Apr 11, 2023·0 cites·11 claims
- 3736US2019016930A1Adhesive compositionDEXERIALS CORP·Filed 2016·Application pending·0 cites
- 3834US2003029559A1Adhesive for connecting electrodes and adhesion methods with the use of the sameSONY CHEMICAL CORP·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →