Inventor · disambiguated record
Toru Kakuda
Also filed as: KAKUDA TORU
9 granted patents·3 pending applications·16 citations·filing 2007–2024
83Inventor score
Technology areasH10P
Top patents by PatentIndex Score
12 records- 0194US11101111B2Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2020·Granted Aug 24, 2021·3 cites·12 claims
- 0289US10763084B2Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Sep 1, 2020·4 cites·10 claims
- 0386US12505989B2Substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Granted Dec 23, 2025·0 cites·14 claims
- 0480US9911580B2Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatusYANAI HIDEHIRO·Filed 2011·Granted Mar 6, 2018·5 cites·17 claims
- 0575US11948778B2Substrate processing apparatus, method of manufacturing semiconductor device, and baffle structure of the substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2021·Granted Apr 2, 2024·0 cites·13 claims
- 0675US9793112B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2016·Granted Oct 17, 2017·2 cites·11 claims
- 0772US10985017B2Method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 20, 2021·1 cites·15 claims
- 0869US12087598B2Substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2018·Granted Sep 10, 2024·1 cites·17 claims
- 0950US11168396B2Method of manufacturing semiconductor device and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Nov 9, 2021·0 cites·13 claims
- 1046US2009176381A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 1143US2008096392A1Ashing systemHITACHI INT ELECTRIC INC·Filed 2007·Application pending·0 cites
- 1240US2019003047A1Vaporizer and Substrate Processing ApparatusKOKUSAI ELECTRIC CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →