Inventor · disambiguated record
Tomoyuki Kanai
Also filed as: KANAI TOMOYUKI
10 granted patents·3 pending applications·29 citations·filing 2005–2022
85Inventor score
Top patents by PatentIndex Score
13 records- 0187US8048258B2Resin composition, and temporary fixing method and surface protecting method for members to be processed, by means thereofDENKI KAGAKU KOGYO KK·Filed 2007·Granted Nov 1, 2011·8 cites·9 claims
- 0286US8859633B2Adherent composition and method of temporarily fixing member therewithOSHIMA KAZUHIRO·Filed 2011·Granted Oct 14, 2014·7 cites·6 claims
- 0384US8415425B2Curable resin composition, surface protection method, temporary fixation method, and separation methodKANAI TOMOYUKI·Filed 2012·Granted Apr 9, 2013·3 cites·18 claims
- 0481US7988811B2Adhesive composition and method for temporarily fixing member by using the sameDENKI KAGAKU KOGYO KK·Filed 2007·Granted Aug 2, 2011·4 cites·9 claims
- 0579US8313604B2Curable composition and temporary fixation method of member using itOSHIMA KAZUHIRO·Filed 2006·Granted Nov 20, 2012·5 cites·12 claims
- 0674US8338526B2Curable resin composition, surface protection method, temporary fixation method, and separation methodKANAI TOMOYUKI·Filed 2011·Granted Dec 25, 2012·1 cites·14 claims
- 0769US9061485B2Method of manufacturing translucent rigid substrate laminateKURIMURA HIROYUKI·Filed 2011·Granted Jun 23, 2015·1 cites·15 claims
- 0863US2025002630A1Copolymer, surfactant, resin composition, and heat dissipation sheetDENKA COMPANY LTD·Filed 2022·Application pending·0 cites
- 0958US2008289750A1Curable Resin Composition, Surface Protection Method, Temporary Fixation Method, and Separation MethodDENKI KAGAKU KOGYO KK·Filed 2007·Application pending·0 cites
- 1051US8187411B2Adherent composition and method of temporarily fixing member therewithOSHIMA KAZUHIRO·Filed 2005·Granted May 29, 2012·0 cites·9 claims
- 1148US12243766B2Back grinding adhesive sheet, and method for manufacturing semiconductor waferDISCO CORP·Filed 2020·Granted Mar 4, 2025·0 cites·13 claims
- 1246US12312512B2Adhesive sheet for backgrinding and production method for semiconductor waferDISCO CORP·Filed 2020·Granted May 27, 2025·0 cites·5 claims
- 1343US2022186089A1Copolymer, dispersant, and resin compositionDENKA COMPANY LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →