Inventor · disambiguated record
Toshinori Kawamura
Also filed as: KAWAMURA TOSHINORI
6 granted patents·7 pending applications·76 citations·filing 1997–2024
80Inventor score
Files withHITACHI LTD7TORAY INDUSTRIES2HITACHI VIA MECHANICS LTD1Hitachi Via Mechanics1KAWAMURA TOSHINORI1
Top patents by PatentIndex Score
13 records- 0186US7666320B2Manufacturing method of printed wiring board as well as copper-clad laminate and treatment solutions used thereforHITACHI VIA MECHANICS LTD·Filed 2006·Granted Feb 23, 2010·11 cites·7 claims
- 0283US5908290AHeat treatment furnace for fiberTORAY INDUSTRIES·Filed 1997·Granted Jun 1, 1999·46 cites·11 claims
- 0379US8366903B2Method for manufacturing printed wiring board and electrolytic etching solution for use in the manufacturing methodHitachi Via Mechanics·Filed 2008·Granted Feb 5, 2013·10 cites·4 claims
- 0470US2025230572A1Repair instruction device and repair instruction methodHITACHI LTD·Filed 2024·Application pending·0 cites
- 0569US2025223718A1Plating device and plating formation methodHITACHI LTD·Filed 2024·Application pending·0 cites
- 0660US12371792B2Laminate, metal plating solution, and manufacturing process of laminateHITACHI LTD·Filed 2020·Granted Jul 29, 2025·0 cites·12 claims
- 0755US11279112B2Coating laminated body and method for producing the sameHITACHI LTD·Filed 2018·Granted Mar 22, 2022·0 cites·9 claims
- 0854US2015000881A1Heat-Transfer DeviceHITACHI LTD·Filed 2014·Application pending·0 cites
- 0949US2011036493A1Surface treatment method for copper and surface treatment method for printed wiring boardKAWAMURA TOSHINORI·Filed 2009·Application pending·0 cites
- 1045US6007465AYarn guide rollerTORAY INDUSTRIES·Filed 1998·Granted Dec 28, 1999·9 cites·2 claims
- 1143US2016091254A1Heat ExchangerHITACHI LTD·Filed 2013·Application pending·0 cites
- 1242US2007202682A1Manufacturing method of semiconductor deviceYAMAMOTO KENICHI·Filed 2007·Application pending·0 cites
- 1339US2018087170A1Wet Surface Treatment ApparatusHITACHI LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →