Heat Exchanger
Abstract
Provided is a heat exchanger having improved heat transfer performance. A heat exchanger according to the present invention includes a heat transfer unit configured to perform heat exchange by contact with gas, and a contact surface of the heat transfer unit to be in contact with the gas is provided with a fine structure body which has a height of 10 μm or less and a surface area of 10 times or more of a smooth surface. The gas desirably has a Reynolds number of 30,000 or more, and the fine structure body is desirably formed of the same material as that of a base material forming the contact surface. Moreover, the fine structure body desirably has heat conductivity equal to or larger than the base material forming the contact surface.
Claims
exact text as granted — not AI-modified1 . A heat exchanger comprising a heat transfer unit configured to perform heat exchange by contact with gas, wherein a contact surface of the heat transfer unit to be in contact with the gas is provided with a fin structure body which has a height of 10 μm or less and a surface area of 10 times or more of a smooth surface.
2 . The heat exchanger according to claim 1 , wherein the gas has a Reynolds number of 30,000 or more.
3 . The heat exchanger according to claim 1 , wherein the fine structure body is formed of the same material as that of the base material.
4 . The heat exchanger according to claim 1 , wherein the fine structure body has heat conductivity equal to or larger than the base material.
5 . The heat exchanger according to claim 1 , wherein the fine structure body has a shape of a dendritic structure or a needle-like structure.
6 . The heat exchanger according to claim 1 , wherein the heat transfer unit has a length of 25 times or more of a characteristic length of a flow.
7 . The heat exchanger according to claim 1 , wherein the base material is copper or copper alloy.Join the waitlist — get patent alerts
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