Inventor · disambiguated record
Toshifumi Kimba
Also filed as: KIMBA TOSHIFUMI
73 granted patents·17 pending applications·1,590 citations·filing 1997–2024
99Inventor score
Top patents by PatentIndex Score
90 records- 0199US7109483B2Method for inspecting substrate, substrate inspecting system and electron beam apparatusEBARA CORP·Filed 2001·Granted Sep 19, 2006·159 cites·9 claims
- 0298US9368314B2Inspection system by charged particle beam and method of manufacturing devices using the systemEBARA CORP·Filed 2014·Granted Jun 14, 2016·38 cites·10 claims
- 0398US7601972B2Inspection system by charged particle beam and method of manufacturing devices using the systemEBARA CORP·Filed 2007·Granted Oct 13, 2009·49 cites·8 claims
- 0498US7138629B2Testing apparatus using charged particles and device manufacturing method using the testing apparatusEBARA CORP·Filed 2004·Granted Nov 21, 2006·151 cites·22 claims
- 0598US6593152B2Electron beam apparatus and method of manufacturing semiconductor device using the apparatusEBARA CORP·Filed 2001·Granted Jul 15, 2003·109 cites·60 claims
- 0697US7741601B2Testing apparatus using charged particles and device manufacturing method using the testing apparatusEBARA CORP·Filed 2008·Granted Jun 22, 2010·36 cites·13 claims
- 0797US7365324B2Testing apparatus using charged particles and device manufacturing method using the testing apparatusEBARA CORP·Filed 2006·Granted Apr 29, 2008·49 cites·7 claims
- 0897US7297949B2Inspection system by charged particle beam and method of manufacturing devices using the systemEBARA CORP·Filed 2006·Granted Nov 20, 2007·28 cites·6 claims
- 0997US7244932B2Electron beam apparatus and device fabrication method using the electron beam apparatusEBARA CORP·Filed 2001·Granted Jul 17, 2007·74 cites·51 claims
- 1097US7223973B2Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using formerEBARA CORP·Filed 2005·Granted May 29, 2007·38 cites·10 claims
- 1197US7135676B2Inspection system by charged particle beam and method of manufacturing devices using the systemEBARA CORP·Filed 2001·Granted Nov 14, 2006·61 cites·12 claims
- 1297US6855929B2Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using formerEBARA CORP·Filed 2001·Granted Feb 15, 2005·106 cites·55 claims
- 1396US7439502B2Electron beam apparatus and device production method using the electron beam apparatusEBARA CORP·Filed 2007·Granted Oct 21, 2008·23 cites·7 claims
- 1496US7417236B2Sheet beam-type testing apparatusEBARA CORP·Filed 2006·Granted Aug 26, 2008·20 cites·18 claims
- 1596US7049585B2Sheet beam-type testing apparatusEBARA CORP·Filed 2001·Granted May 23, 2006·55 cites·7 claims
- 1695US8822919B2Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using formerKIMBA TOSHIFUMI·Filed 2011·Granted Sep 2, 2014·15 cites·10 claims
- 1795US7411191B2Inspection system by charged particle beam and method of manufacturing devices using the systemEBARA CORP·Filed 2007·Granted Aug 12, 2008·20 cites·4 claims
- 1894US8946631B2Testing apparatus using charged particles and device manufacturing method using the testing apparatusEBARA CORP·Filed 2014·Granted Feb 3, 2015·11 cites·14 claims
- 1994US7241993B2Inspection system by charged particle beam and method of manufacturing devices using the systemTOSHIBA KK·Filed 2001·Granted Jul 10, 2007·54 cites·12 claims
- 2094US7095022B2Electron beam apparatus and method of manufacturing semiconductor device using the apparatusNIKON CORP·Filed 2001·Granted Aug 22, 2006·48 cites·13 claims
- 2193US7928378B2Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using formerEBARA CORP·Filed 2008·Granted Apr 19, 2011·17 cites·11 claims
- 2293US7425703B2Electron beam apparatus, a device manufacturing method using the same apparatus, a pattern evaluation method, a device manufacturing method using the same method, and a resist pattern or processed wafer evaluation methodEBARA CORP·Filed 2005·Granted Sep 16, 2008·16 cites·3 claims
- 2393US7408175B2Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using formerEBARA CORP·Filed 2007·Granted Aug 5, 2008·19 cites·9 claims
- 2492US7829871B2Sheet beam-type testing apparatusEBARA CORP·Filed 2008·Granted Nov 9, 2010·10 cites·7 claims
- 2591US8053726B2Inspection system by charged particle beam and method of manufacturing devices using the systemEBARA CORP·Filed 2008·Granted Nov 8, 2011·11 cites·11 claims
- 2691US7129485B2Electron beam apparatus and method of manufacturing semiconductor device using the apparatusEBARA CORP·Filed 2004·Granted Oct 31, 2006·30 cites·8 claims
- 2790US8803103B2Inspection system by charged particle beam and method of manufacturing devices using the systemEBARA CORP·Filed 2013·Granted Aug 12, 2014·6 cites·7 claims
- 2890US8115912B2Polishing end point detection method, polishing end point detection apparatus, and polishing apparatusKIMBA TOSHIFUMI·Filed 2011·Granted Feb 14, 2012·7 cites·18 claims
- 2990US7247848B2Electron beam apparatus and method of manufacturing semiconductor device using the apparatusEBARA CORP·Filed 2003·Granted Jul 24, 2007·28 cites·16 claims
- 3090US7109484B2Sheet beam-type inspection apparatusEBARA CORP·Filed 2004·Granted Sep 19, 2006·23 cites·6 claims
- 3189US8045142B2Polishing end point detection method, polishing end point detection apparatus and polishing apparatusEBARA CORP·Filed 2008·Granted Oct 25, 2011·12 cites·26 claims
- 3289US6785010B2Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatusEBARA CORP·Filed 2000·Granted Aug 31, 2004·35 cites·16 claims
- 3388US9266214B2Polishing method and polishing apparatusEBARA CORP·Filed 2014·Granted Feb 23, 2016·7 cites·25 claims
- 3488US7888642B2Electron beam apparatus and method of manufacturing semiconductor device using the apparatusEBARA CORP·Filed 2008·Granted Feb 15, 2011·9 cites·9 claims
- 3588US7072050B2Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatusEBARA CORP·Filed 2004·Granted Jul 4, 2006·29 cites·18 claims
- 3687US7423267B2Electron beam apparatus and method of manufacturing semiconductor device using the apparatusEBARA CORP·Filed 2006·Granted Sep 9, 2008·8 cites·5 claims
- 3787US6657737B2Method and apparatus for measuring film thicknessEBARA CORP·Filed 2000·Granted Dec 2, 2003·40 cites·2 claims
- 3886US9406480B2Testing apparatus using charged particles and device manufacturing method using the testing apparatusEBARA CORP·Filed 2015·Granted Aug 2, 2016·3 cites·14 claims
- 3985US7408643B2Method and apparatus for inspecting samples, and method for manufacturing devices using method and apparatus for inspecting samplesEBARA CORP·Filed 2007·Granted Aug 5, 2008·12 cites·7 claims
- 4083US8742341B2Testing apparatus using charged particles and device manufacturing method using the testing apparatusNOJI NOBUHARU·Filed 2010·Granted Jun 3, 2014·4 cites·13 claims
- 4183US8368031B2Inspection system by charged particle beam and method of manufacturing devices using the systemEBARA CORP·Filed 2011·Granted Feb 5, 2013·3 cites·7 claims
- 4283US8067732B2Electron beam apparatusNAKASUJI MAMORU·Filed 2006·Granted Nov 29, 2011·8 cites·4 claims
- 4382US8280664B2XY-coordinate compensation apparatus and method in sample pattern inspection apparatusKIMBA TOSHIFUMI·Filed 2007·Granted Oct 2, 2012·8 cites·17 claims
- 4481US9136091B2Electron beam apparatus for inspecting a pattern on a sample using multiple electron beamsEBARA CORP·Filed 2013·Granted Sep 15, 2015·4 cites·52 claims
- 4581US8687197B2Method of monitoring progress of substrate polishing and polishing apparatusKIMBA TOSHIFUMI·Filed 2011·Granted Apr 1, 2014·5 cites·23 claims
- 4680US8639463B2Electron beam apparatus for inspecting a pattern on a sample using multiple electron beamsKIMBA TOSHIFUMI·Filed 2012·Granted Jan 28, 2014·4 cites·16 claims
- 4779US10663287B2Polishing apparatusEBARA CORP·Filed 2019·Granted May 26, 2020·1 cites·11 claims
- 4879US7675634B2Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatusEBARA CORP·Filed 2008·Granted Mar 9, 2010·4 cites·16 claims
- 4979US7428064B2Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatusEBARA CORP·Filed 2006·Granted Sep 23, 2008·4 cites·12 claims
- 5078US7745784B2Electron beam apparatus and method of manufacturing semiconductor device using the apparatusEBARA CORP·Filed 2007·Granted Jun 29, 2010·4 cites·8 claims
Showing the top 50 of 90 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →