Inventor · disambiguated record
Toshimasa Kobayashi
Also filed as: KOBAYASHI TOSHIMASA · TAKABA TOSHIO
24 granted patents·11 pending applications·814 citations·filing 1978–2023
96Inventor score
Top patents by PatentIndex Score
35 records- 0197US6064082AHeterojunction field effect transistorSONY CORP·Filed 1998·Granted May 16, 2000·333 cites·9 claims
- 0295US5521140ARecording unit structure and recording deviceSONY CORP·Filed 1994·Granted May 28, 1996·94 cites·16 claims
- 0394US6921673B2Nitride semiconductor device and method of manufacturing the sameSONY CORP·Filed 2002·Granted Jul 26, 2005·75 cites·5 claims
- 0489US6784010B2Nitride-based semiconductor laser device and method for the production thereofSONY CORP·Filed 2002·Granted Aug 31, 2004·28 cites·9 claims
- 0585US6281032B1Manufacturing method for nitride III-V compound semiconductor device using bondingSONY CORP·Filed 1999·Granted Aug 28, 2001·61 cites·16 claims
- 0684US6838703B2Nitride-based semiconductor laser device and method for the production thereofSONY CORP·Filed 2004·Granted Jan 4, 2005·19 cites·8 claims
- 0780US6482666B1Semiconductor device, its manufacturing method and substrate for manufacturing a semiconductor deviceSONY CORP·Filed 2000·Granted Nov 19, 2002·26 cites·26 claims
- 0879US12094697B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Granted Sep 17, 2024·0 cites·4 claims
- 0978US6620641B2Semiconductor light emitting device and its manufacturing methodSONY CORP·Filed 2002·Granted Sep 16, 2003·14 cites·8 claims
- 1074US6025213ASemiconductor light-emitting device package and method of manufacturing the sameSONY CORP·Filed 1997·Granted Feb 15, 2000·39 cites·6 claims
- 1173US4179800APrinted wiring board comprising a conductive pattern retreating at least partly in a through-holeNIPPON ELECTRIC CO·Filed 1978·Granted Dec 25, 1979·31 cites·1 claims
- 1272US6455342B2Semiconductor device, its manufacturing method and substrate for manufacturing a semiconductor deviceSONY CORP·Filed 2001·Granted Sep 24, 2002·16 cites·27 claims
- 1371US6278173B1Semiconductor device, its manufacturing method and substrate for manufacturing a semiconductor deviceSONY CORP·Filed 1999·Granted Aug 21, 2001·36 cites·19 claims
- 1469US11756774B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Sep 12, 2023·0 cites·6 claims
- 1565US5096741ACorrosionproof coating material and method for formation of coating therewithSANKYO SEIKI SEISAKUSHO KK·Filed 1989·Granted Mar 17, 1992·16 cites·10 claims
- 1664US7622318B2Method for producing structured substrate, structured substrate, method for producing semiconductor light emitting device, semiconductor light emitting device, method for producing semiconductor device, semiconductor device, method for producing device, and deviceSONY CORP·Filed 2004·Granted Nov 24, 2009·7 cites·38 claims
- 1762US8453004B2Microcomputer with reset pin and electronic control unit with the sameKOBAYASHI TOSHIMASA·Filed 2007·Granted May 28, 2013·4 cites·10 claims
- 1861US7789566B2Dynamical pressure bearing device, motor, and recording disc driving deviceNIDEC CORP·Filed 2005·Granted Sep 7, 2010·2 cites·7 claims
- 1960US6896143B2Electrolytic machining method, method for manufacturing dynamic pressure bearing devices, and dynamic pressure bearing devices manufactured according to the manufacturing methodSANKYO SEIKI SEISAKUSHO KK·Filed 2002·Granted May 24, 2005·7 cites·17 claims
- 2058US7893454B2Method for producing structured substrate, structured substrate, method for producing semiconductor light emitting device, semiconductor light emitting device, method for producing semiconductor device, semiconductor device, method for producing device, and deviceSONY CORP·Filed 2009·Granted Feb 22, 2011·0 cites·9 claims
- 2155US2023195965A1List generating apparatusSUBARU CORP·Filed 2022·Application pending·0 cites
- 2252US11320257B2Component machining apparatusSUBARU CORP·Filed 2019·Granted May 3, 2022·0 cites·4 claims
- 2348US2009193273A1Electronic control system with controllers and power supply unitDENSO CORP·Filed 2009·Application pending·0 cites
- 2446US2020050658A1Analysis deviceSUBARU CORP·Filed 2019·Application pending·0 cites
- 2544US12086734B2Manufacturing assistance apparatusSUBARU CORP·Filed 2018·Granted Sep 10, 2024·0 cites·10 claims
- 2644US2020194238A1Structure for substrate processing apparatusTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 2743US2007138487A1Semiconductor light emitting device and method of manufacturing the sameWATANABE YOSHIAKE·Filed 2006·Application pending·0 cites
- 2843US2007145396A1Semiconductor light emitting device and method of manufacturing the sameWATANABE YOSHIAKI·Filed 2006·Application pending·0 cites
- 2942US2009247433A1Method of preventing lubricant from deteriorating, lubricant, and dynamic-pressure bearing deviceNIDEC CORP·Filed 2007·Application pending·0 cites
- 3041US2005184302A1Nitride semiconductor device and method of manufacturing the sameFiled 2005·Application pending·0 cites
- 3137US5387549AProcess for fabricating ohmic contactSONY CORP·Filed 1994·Granted Feb 7, 1995·5 cites·3 claims
- 3236US2003217931A1Electrolytic machining method and electrolytic machining apparatusSANKYO SEIKI SEISAKUSHO KK·Filed 2003·Application pending·0 cites
- 3335US2002060828A1Air dynamic pressure bearing and optical deflectorFiled 2001·Application pending·0 cites
- 3431US5699098ARecording unit structure and recording deviceSONY CORP·Filed 1996·Granted Dec 16, 1997·1 cites·7 claims
- 3531US2003207480A1Method of manufacturing semiconductor deviceFiled 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Toshimasa Kobayashi files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →