Inventor · disambiguated record
Tomohiko Kotake
Also filed as: KOTAKE TOMOHIKO
33 granted patents·39 pending applications·18 citations·filing 2007–2025
94Inventor score
Files withHITACHI CHEMICAL CO LTD32RESONAC CORP24SHOWA DENKO MATERIALS CO LTD8KOTAKE TOMOHIKO3TSUCHIKAWA SHINJI2
Top patents by PatentIndex Score
72 records- 0192US10995184B2Sol composition, aerogel composite, support member provided with aerogel composite, and heat insulatorHITACHI CHEMICAL CO LTD·Filed 2017·Granted May 4, 2021·6 cites·20 claims
- 0292US10590001B2Aerogel composite, and supporting member and heat insulation material provided with aerogel compositeHITACHI CHEMICAL CO LTD·Filed 2015·Granted Mar 17, 2020·4 cites·17 claims
- 0385US2025368839A1Coating liquid, production method for coating film, and coating filmRESONAC CORP·Filed 2025·Application pending·0 cites
- 0483US11326055B2Aerogel composite powderHITACHI CHEMICAL CO LTD·Filed 2017·Granted May 10, 2022·1 cites·20 claims
- 0583US10414943B2Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminateHITACHI CHEMICAL CO LTD·Filed 2016·Granted Sep 17, 2019·1 cites·11 claims
- 0679US10563016B2AerogelHITACHI CHEMICAL CO LTD·Filed 2015·Granted Feb 18, 2020·1 cites·6 claims
- 0776US11220579B2Sol compositionHITACHI CHEMICAL CO LTD·Filed 2020·Granted Jan 11, 2022·0 cites·13 claims
- 0875US10821705B2Aerogel laminated composite and thermal insulation materialHITACHI CHEMICAL CO LTD·Filed 2016·Granted Nov 3, 2020·1 cites·18 claims
- 0975US10738165B2AerogelHITACHI CHEMICAL CO LTD·Filed 2018·Granted Aug 11, 2020·0 cites·7 claims
- 1074US11117353B2Production method for aerogel laminate, and aerogel laminate rollHITACHI CHEMICAL CO LTD·Filed 2019·Granted Sep 14, 2021·0 cites·3 claims
- 1174US10119047B2Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted Nov 6, 2018·1 cites·22 claims
- 1271US9603244B2Thermosetting resin composition and prepreg and laminate obtained with the sameTSUCHIKAWA SHINJI·Filed 2007·Granted Mar 21, 2017·2 cites·14 claims
- 1370US12256490B2Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2018·Granted Mar 18, 2025·0 cites·16 claims
- 1470US11780735B2Aerogel composite, and supporting member and heat insulation material provided with aerogel compositeHITACHI CHEMICAL CO LTD·Filed 2020·Granted Oct 10, 2023·0 cites·6 claims
- 1570US11333288B2Aerogel laminate and thermal insulation materialHITACHI CHEMICAL CO LTD·Filed 2019·Granted May 17, 2022·0 cites·7 claims
- 1668US12410326B2Coating liquid, production method for coating film, and coating filmHITACHI CHEMICAL CO LTD·Filed 2018·Granted Sep 9, 2025·0 cites·20 claims
- 1767US9079376B2Prepreg, laminate obtained with the same and printed-wiring boardKOTAKE TOMOHIKO·Filed 2012·Granted Jul 14, 2015·1 cites·22 claims
- 1867US2025172267A1Anti-fogging agent, anti-fogging method for vehicle lamp structure, and vehicle lamp structureRESONAC CORP·Filed 2023·Application pending·0 cites
- 1967US2018094162A1Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminateHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 2066US2025297110A1Resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 2166US2022228029A1Water-repellent agent, water-repellent structure, and production method for said structureSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 2266US2025234456A1Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor packageRESONAC CORP·Filed 2025·Application pending·0 cites
- 2365US12435236B2Coating liquid, composite material, and coating filmSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Oct 7, 2025·0 cites·2 claims
- 2465US2025326925A1Support body-equipped resin film, manufacturing method for printed wiring board, and manufacturing method for semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 2564US2025250430A1Resin composition, resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 2662US11713375B2Barrier material formation composition, barrier material, production method for barrier material, product, and production method for productHITACHI CHEMICAL CO LTD·Filed 2018·Granted Aug 1, 2023·0 cites·11 claims
- 2762US10604641B2Thermosetting resin composition and prepreg and laminate both made with the sameHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 31, 2020·0 cites·15 claims
- 2862US10556405B2Production method for aerogel laminate, and aerogel laminate rollHITACHI CHEMICAL CO LTD·Filed 2016·Granted Feb 11, 2020·0 cites·5 claims
- 2962US2025180185A1Anti-fogging agent, anti-fogging method for vehicle lamp structure, and vehicle lamp structureRESONAC CORP·Filed 2022·Application pending·0 cites
- 3062US2023391939A1Resin composition, prepreg, laminated plate, resin film, printed wiring board, and semiconductor packageSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 3162US2020010725A1Water-repellent agent, water-repellent structure, and production method for said structureHITACHI CHEMICAL CO LTD·Filed 2018·Application pending·0 cites
- 3261US12264224B2Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor packageSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Apr 1, 2025·0 cites·19 claims
- 3361US11787957B2Coating solution, method for producing coating film, and coating filmHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 17, 2023·0 cites·16 claims
- 3461US2017156207A1Thermosetting resin composition and prepreg and laminate obtained with the sameHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 3560US12043747B2Coating solution, method for producing coating film, and coating filmHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jul 23, 2024·0 cites·9 claims
- 3659US12331195B2Composite material, sheet, and heat insulatorSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jun 17, 2025·0 cites·11 claims
- 3759US12110414B2Method for suppressing corrosion under heat-insulating material, and paste for suppressing corrosion under heat-insulating materialRESONAC CORP·Filed 2018·Granted Oct 8, 2024·0 cites·12 claims
- 3859US2023407134A1Antifogging agent, hydrophilizing agent, and antifogging method for vehicular lamp structureRESONAC CORP·Filed 2021·Application pending·0 cites
- 3959US2018022061A1Aerogel laminate and thermal insulation materialHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 4058US2025326929A1Resin composition, prepreg, laminate, resin film, printed wiring board and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 4158US2025282128A1Method for manufacturing sound-absorbing memberRESONAC CORP·Filed 2022·Application pending·0 cites
- 4258US2012276392A1Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminateTAKAHASHI YOSHIHIRO·Filed 2010·Application pending·0 cites
- 4357US2025257181A1Prepreg, laminated plate, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 4454US11905452B2Treatment agent for treating fibers, fibers and production method therefor, and fiber sheet and production method thereforHITACHI CHEMICAL CO LTD·Filed 2018·Granted Feb 20, 2024·0 cites·4 claims
- 4553US10227455B2AerogelHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 12, 2019·0 cites·7 claims
- 4653US2023393055A1Water film evaluation method, and antifogging agent evaluation methodRESONAC CORP·Filed 2021·Application pending·0 cites
- 4753US2025159815A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 4853US2024217455A1Sound absorbing material, and vehicle memberRESONAC CORP·Filed 2021·Application pending·0 cites
- 4953US2025142722A1Member for forming wiring, method for forming wiring layer using member for forming wiring, and formed wiring memberRESONAC CORP·Filed 2023·Application pending·0 cites
- 5052US11673810B2Aerogel and method for producing sameHITACHI CHEMICAL CO LTD·Filed 2017·Granted Jun 13, 2023·0 cites·7 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →