Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate

Abstract

Discloses are a thermosetting resin composition containing a maleimide compound including an unsaturated maleimide compound having a specified chemical structure, a thermosetting resin, an inorganic filler, and a molybdenum compound; a laminate plate for wiring boards obtained by coating a base material with a thermosetting resin composition containing a thermosetting resin, silica, and a specified molybdenum compound and then performing semi-curing to form a prepreg, and laminating and molding the prepreg; and a method for manufacturing a resin composition varnish including specified steps. According to the present invention, electronic components having low thermal expansion properties and excellent drilling processability and heat resistance, for example, a prepreg, a laminate plate, an interposer, etc., can be provided.

1 . A thermosetting resin composition comprising (A) a maleimide compound containing an unsaturated maleimide compound having an acidic substituent, as represented by the following general formula (I) or (II), (B) a thermosetting resin, (C) an inorganic filler, and (D) a molybdenum compound: 
       
         
           
           
               
               
           
         
       
       wherein R 1  represents a hydroxyl group, a carboxyl group, or a sulfonic acid group, each of which is the acidic substituent; each of R 2 , R 3 , R 4 , and R 5  independently represents a hydrogen atom, an aliphatic hydrocarbon group having a carbon number of from 1 to 5, or a halogen atom; A represents an alkylene group, an alkylidene group, an ether group, a sulfonyl group, or a group represented by the following formula (III); x represents an integer of from 1 to 5; y represents an integer of from 0 to 4; and a sum of x and y is 5: 
       
         
           
           
               
               
           
         
       
     
     
         2 . The thermosetting resin composition according to  claim 1 , wherein the molybdenum compound (D) is at least one member selected from the group consisting of a molybdenum oxide and a molybdic acid compound, and a content of the molybdenum compound is from 0.02 to 20% by volume of the whole of the resin composition. 
     
     
         3 . The thermosetting resin composition according to  claim 1 , wherein the thermosetting resin (B) is an epoxy resin; a total sum content of the component (A) and the component (B) is from 30 to 80% by volume of the whole of the resin composition; and a mass ratio of the component (A) and the component (B) is from 20 to 90 parts by mass in terms of the component (A) based on 100 parts by mass of the total sum content of the component (A) and the component (B). 
     
     
         4 . The thermosetting resin composition according to  claim 1 , wherein the inorganic filler (C) is fused spherical silica, and a content of the inorganic filler is from 10 to 60% by volume of the whole of the resin composition. 
     
     
         5 . A prepreg obtained by impregnating or coating a base material with the thermosetting resin composition according to  claim 1  and then performing B-staging. 
     
     
         6 . A laminate plate obtained by laminating and molding the prepreg according to  claim 5 . 
     
     
         7 . The laminate plate according to  claim 6 , which is a metal clad laminate plate obtained by superimposing a metal foil on at least one surface of the prepreg and then performing heat pressure molding. 
     
     
         8 . A laminate plate for wiring boards, obtained by coating a thermosetting resin composition containing (E) a thermosetting resin, (F) silica, and (G) at least one molybdenum compound selected from the group consisting of zinc molybdate, calcium molybdate, and magnesium molybdate, with a content of the silica (F) being 20% by volume or more and not more than 60% by volume, on a base material in a film form or fiber form, then performing semi-curing to form a prepreg, and laminating and molding the prepreg. 
     
     
         9 . The laminate plate for wiring boards according to  claim 8 , wherein the silica (F) is fused spherical silica having an average particle size of 0.1 μm or more and not more than 1 μm, and a content of the molybdenum compound (G) is from 0.1% by volume or more and not more than 10% by volume of the whole of the resin composition. 
     
     
         10 . The laminate plate for wiring boards according to  claim 8 , wherein the thermosetting resin composition is varnished. 
     
     
         11 . The laminate plate for wiring boards according to  claim 8 , wherein the base material in a film form or fiber form is a glass cloth. 
     
     
         12 . A method for manufacturing a resin composition varnish comprising
 a first dispersing and mixing step of dispersing and mixing (I) a molybdenum compound in (H) a slurry containing a silica particle having an average particle size of 0.01 μm or more and not more than 0.1 μm and a specific surface area of 30 m 2 /g or more and not more than 270 m 2 /g,   a second dispersing and mixing step of dispersing and mixing the slurry having gone through the first dispersing and mixing step in a varnish containing (J) a thermosetting resin, and   a third dispersing and mixing step of dispersing and mixing (K) an inorganic filler exclusive of the silica particle and the molybdenum compound in the varnish having gone through the second dispersing and mixing step.   
     
     
         13 . The method for manufacturing a resin composition varnish according to  claim 12 , further comprising a curing accelerator adding step of adding a curing accelerator to the varnish after the third dispersing and mixing step. 
     
     
         14 . The method for manufacturing a resin composition varnish according to  claim 12 , wherein the molybdenum compound (I) is one member or a mixture of two or more members selected from the group consisting of zinc molybdate, calcium molybdate, and magnesium molybdate. 
     
     
         15 . A prepreg comprising a base material impregnated and coated with a resin composition obtained through a first dispersing and mixing step of dispersing and mixing (I) a molybdenum compound in (H) a slurry containing a silica particle having an average particle size of 0.01 μm or more and not more than 0.1 μm and a specific surface area of 30 m 2 /g or more and not more than 270 m 2 /g; a second dispersing and mixing step of dispersing and mixing the slurry having gone through the first dispersing and mixing step in a varnish containing (J) a thermosetting resin; and a third dispersing and mixing step of dispersing and mixing (K) an inorganic filler in the varnish having gone through the second dispersing and mixing step. 
     
     
         16 . A laminate plate obtained by laminating and molding the prepreg according to  claim 15 .