Inventor · disambiguated record
Shinji Tsuchikawa
Also filed as: TSUCHIKAWA SHINJI
15 granted patents·6 pending applications·47 citations·filing 1994–2021
89Inventor score
Files withHITACHI CHEMICAL CO LTD12TSUCHIKAWA SHINJI5KOTAKE TOMOHIKO2RESONAC CORP1TAKAHASHI YOSHIHIRO1
Top patents by PatentIndex Score
21 records- 0183US10414943B2Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminateHITACHI CHEMICAL CO LTD·Filed 2016·Granted Sep 17, 2019·1 cites·11 claims
- 0278US7208539B2Thermosetting resin composition, and prepreg and laminated board using the sameHITACHI CHEMICAL CO LTD·Filed 2003·Granted Apr 24, 2007·15 cites·16 claims
- 0376US6667107B2Thermosetting resin composition and use thereofHITACHI CHEMICAL CO LTD·Filed 2002·Granted Dec 23, 2003·18 cites·30 claims
- 0474US10119047B2Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted Nov 6, 2018·1 cites·22 claims
- 0571US9603244B2Thermosetting resin composition and prepreg and laminate obtained with the sameTSUCHIKAWA SHINJI·Filed 2007·Granted Mar 21, 2017·2 cites·14 claims
- 0667US9079376B2Prepreg, laminate obtained with the same and printed-wiring boardKOTAKE TOMOHIKO·Filed 2012·Granted Jul 14, 2015·1 cites·22 claims
- 0767US2018094162A1Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminateHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 0862US10604641B2Thermosetting resin composition and prepreg and laminate both made with the sameHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 31, 2020·0 cites·15 claims
- 0961US2017156207A1Thermosetting resin composition and prepreg and laminate obtained with the sameHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 1060US8796473B2Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminateTSUCHIKAWA SHINJI·Filed 2007·Granted Aug 5, 2014·0 cites·5 claims
- 1158US8461332B2Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminateTSUCHIKAWA SHINJI·Filed 2012·Granted Jun 11, 2013·0 cites·6 claims
- 1258US2012276392A1Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminateTAKAHASHI YOSHIHIRO·Filed 2010·Application pending·0 cites
- 1355US10681807B2Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·9 claims
- 1454US7078106B2Thermosetting resin composition and use thereofHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jul 18, 2006·1 cites·10 claims
- 1552US12168709B2Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible moduleRESONAC CORP·Filed 2021·Granted Dec 17, 2024·0 cites·20 claims
- 1650US11581212B2Prepreg for coreless substrate, coreless substrate and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2018·Granted Feb 14, 2023·0 cites·12 claims
- 1748US2012077401A1Resin composition for production of clad layer, resin film for production of clad layer utilizing the resin composition, and optical waveguide and optical module each utilizing the resin composition or the resin filmKOTAKE TOMOHIKO·Filed 2010·Application pending·0 cites
- 1846US2010279129A1Thermosetting resin composition and prepreg and laminate both made with the same.TSUCHIKAWA SHINJI·Filed 2008·Application pending·0 cites
- 1943US2013172459A1Process for producing compatibilized resin, thermosetting resin composition, prepreg, and laminateTSUCHIKAWA SHINJI·Filed 2011·Application pending·0 cites
- 2042US11214660B2Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrateHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jan 4, 2022·0 cites·9 claims
- 2140US5476690AProcess for preparing printed circuit boardHITACHI CHEMICAL CO LTD·Filed 1994·Granted Dec 19, 1995·8 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →