Thermosetting resin composition and prepreg and laminate both made with the same.

Abstract

The present invention provides a thermosetting resin composition comprising (A) a metal salt of disubstituted phosphinic acid, (B) a maleimide compound having a N-substituted maleimide group in a molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin having at least two epoxy groups in a molecule and a prepreg and a laminated plate which are prepared by using the same. The prepregs obtained by impregnating or coating a base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments.

1 . A thermosetting resin composition comprising:
 (A) a metal salt of disubstituted phosphinic acid,   (B) a maleimide compound having a N-substituted maleimide group in a molecule,   (C) a 6-substituted guanamine compound represented by the following Formula (1) or dicyandiamide and   (D) an epoxy resin having at least two epoxy groups in a molecule:   
       
         
           
           
               
               
           
         
       
       (wherein R 1  represents phenyl, methyl, allyl, vinyl, butyl, methoxy or benzyloxy). 
     
     
         2 . The thermosetting resin composition according to  claim 1 , wherein the maleimide compound having a N-substituted maleimide group in a molecule contains a compound having an acidic substituent and an unsaturated maleimide group represented by the following Formula (3) or Formula (4), which is a product produced by reacting (b-1) a maleimide compound having at least two N-substituted maleimide groups in a molecule with (b-2) an amine compound having an acidic substituent represented by the following Formula (2) in an organic solvent: 
       
         
           
           
               
               
           
         
       
       (wherein R 2  each represents independently an acidic substituent selected from a hydroxyl group, a carboxy group and a sulfonic acid group; R 3  each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; x is an integer of 1 to 5, and y is an integer of 0 to 4; and a sum of x and y is 5); 
       
         
           
           
               
               
           
         
       
       (wherein R 2 , R 3 , x and y represent the same ones as in Formula (2); R 4  each represents independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom); 
       
         
           
           
               
               
           
         
       
       (wherein R 2 , R 3 , x and y represent the same ones as in Formula (2); R 5  and R 6  each represent independently a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A is an alkylene group, an alkylidene group, an ether group, a sulfonyl group or a group represented by the following Formula (5); 
       
         
           
           
               
               
           
         
       
     
     
         3 . A prepreg obtained by impregnating or coating a base material with the thermosetting resin composition according to  claim 1  and then subjecting it to a B stage. 
     
     
         4 . A laminated plate obtained by laminating and molding the prepreg according to  claim 3 . 
     
     
         5 . The laminated plate according to  claim 4 , wherein it is a metal clad laminated plate obtained by superposing a metal foil on at least one side of the prepreg and then heating, pressing and molding it. 
     
     
         6 . A prepreg obtained by impregnating or coating a base material with the thermosetting resin composition according to  claim 2  and then subjecting it to a B stage. 
     
     
         7 . A laminated plate obtained by laminating and molding the prepreg according to  claim 6 . 
     
     
         8 . The laminated plate according to  claim 7 , wherein it is a metal clad laminated plate obtained by superposing a metal foil on at least one side of the prepreg and then heating, pressing and molding it.