Inventor · disambiguated record
Yasuo Kamigata
Also filed as: KAMIGATA YASUO
21 granted patents·13 pending applications·270 citations·filing 1994–2025
95Inventor score
Top patents by PatentIndex Score
34 records- 0192US5881353AMethod for producing porous bodiesHITACHI CHEMICAL CO LTD·Filed 1994·Granted Mar 9, 1999·70 cites·18 claims
- 0287US7319072B2Polishing medium for chemical-mechanical polishing, and method of polishing substrate memberHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jan 15, 2008·13 cites·11 claims
- 0386US6899821B2Abrasive liquid for metal and method for polishingHITACHI LTD·Filed 2001·Granted May 31, 2005·31 cites·9 claims
- 0485US7367870B2Polishing fluid and polishing methodHITACHI CHEMICAL CO LTD·Filed 2003·Granted May 6, 2008·29 cites·19 claims
- 0584US8491807B2Abrasive liquid for metal and method for polishingUCHIDA TAKESHI·Filed 2011·Granted Jul 23, 2013·5 cites·22 claims
- 0683US10414943B2Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminateHITACHI CHEMICAL CO LTD·Filed 2016·Granted Sep 17, 2019·1 cites·11 claims
- 0779US9050780B2Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plateHITACHI CHEMICAL CO LTD·Filed 2012·Granted Jun 9, 2015·4 cites·18 claims
- 0874US7232529B1Polishing compound for chemimechanical polishing and polishing methodHITACHI CHEMICAL CO LTD·Filed 2000·Granted Jun 19, 2007·14 cites·6 claims
- 0974US5943543AHeat transmitting member and method of manufacturing the sameHITACHI CHEMICAL CO LTD·Filed 1994·Granted Aug 24, 1999·36 cites·9 claims
- 1073US7744666B2Polishing medium for chemical-mechanical polishing, and method of polishing substrate memberHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jun 29, 2010·4 cites·56 claims
- 1173US6896825B1Abrasive liquid for metal and method for polishingHITACHI LTD·Filed 1999·Granted May 24, 2005·30 cites·25 claims
- 1271US9101061B2Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plateHITACHI CHEMICAL CO LTD·Filed 2012·Granted Aug 4, 2015·2 cites·22 claims
- 1370US12256490B2Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2018·Granted Mar 18, 2025·0 cites·16 claims
- 1469US8226849B2Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the sameUCHIDA TAKESHI·Filed 2006·Granted Jul 24, 2012·2 cites·18 claims
- 1567US2018094162A1Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminateHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 1666US2025234456A1Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor packageRESONAC CORP·Filed 2025·Application pending·0 cites
- 1765US7799686B2Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the sameHITACHI LTD·Filed 2007·Granted Sep 21, 2010·1 cites·35 claims
- 1863US7887609B2Polishing slurry for polishing aluminum film and polishing method for polishing aluminum film using the sameHITACHI CHEMICAL CO LTD·Filed 2006·Granted Feb 15, 2011·1 cites·12 claims
- 1963US7799688B2Polishing fluid and method of polishingHITACHI CHEMICAL CO LTD·Filed 2003·Granted Sep 21, 2010·8 cites·11 claims
- 2061US8696929B2Polishing slurry and polishing methodKURATA YASUSHI·Filed 2007·Granted Apr 15, 2014·1 cites·11 claims
- 2159US7250369B1Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jul 31, 2007·16 cites·13 claims
- 2258US2012276392A1Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminateTAKAHASHI YOSHIHIRO·Filed 2010·Application pending·0 cites
- 2355US8900477B2Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the sameUCHIDA TAKESHI·Filed 2008·Granted Dec 2, 2014·0 cites·36 claims
- 2451US8038898B2Abrasive liquid for metal and method for polishingHITACHI CHEMICAL CO LTD·Filed 2004·Granted Oct 18, 2011·2 cites·15 claims
- 2551US2007190906A1Polishing medium for chemical-mechanical polishing, and polishing methodUCHIDA TAKESHI·Filed 2007·Application pending·0 cites
- 2649US2013180760A1Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plateHITACHI CHEMICAL CO LTD·Filed 2012·Application pending·0 cites
- 2749US2006186373A1Polishing medium for chemical-mechanical polishing, and polishing methodUCHIDA TAKESHI·Filed 2006·Application pending·0 cites
- 2849US2013112459A1Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plateHITACHI CHEMICAL CO LTD·Filed 2012·Application pending·0 cites
- 2946US2010301265A1Polishing slurry and method of polishingHITACHI CHEMICAL CO LTD·Filed 2010·Application pending·0 cites
- 3045US2013180769A1Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plateHITACHI CHEMICAL CO LTD·Filed 2012·Application pending·0 cites
- 3142US2008105651A1Polishing Slurry for CmpMABUCHI KATSUMI·Filed 2005·Application pending·0 cites
- 3241US2007196975A1Metal-Polishing Liquid And Polishing Method Using The SameHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 3340US2011027994A1Polishing slurry for cmpMABUCHI KATSUMI·Filed 2010·Application pending·0 cites
- 3436US2003219982A1CMP (chemical mechanical polishing) polishing liquid for metal and polishing methodHITACHI CHEMICAL CO LTD·Filed 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Yasuo Kamigata files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →