Inventor · disambiguated record
Torsten Kramer
Also filed as: KRAMER TORSTEN
15 granted patents·4 pending applications·29 citations·filing 1999–2021
88Inventor score
Top patents by PatentIndex Score
19 records- 0189US9926188B2Sensor unit including a decoupling structure and manufacturing method thereforBOSCH GMBH ROBERT·Filed 2015·Granted Mar 27, 2018·7 cites·29 claims
- 0288US8470631B2Method for manufacturing capped MEMS componentsKRAMER TORSTEN·Filed 2010·Granted Jun 25, 2013·10 cites·5 claims
- 0375US7989263B2Method for manufacturing a micromechanical chip and a component having a chip of this typeBOSCH GMBH ROBERT·Filed 2009·Granted Aug 2, 2011·5 cites·10 claims
- 0460US8530261B2Method for producing a component, and sensor elementKRAMER TORSTEN·Filed 2007·Granted Sep 10, 2013·1 cites·9 claims
- 0556US8405210B2Method for producing a plurality of chips and a chip produced accordinglyKRAMER TORSTEN·Filed 2008·Granted Mar 26, 2013·1 cites·10 claims
- 0651US8389327B2Method for manufacturing chipsKRAMER TORSTEN·Filed 2008·Granted Mar 5, 2013·0 cites·21 claims
- 0750US12145808B2Method and device for handling (hygiene) productsFOCKE & CO·Filed 2021·Granted Nov 19, 2024·0 cites·20 claims
- 0850US10988377B2Method for producing a stress-decoupled micromechanical pressure sensorBOSCH GMBH ROBERT·Filed 2017·Granted Apr 27, 2021·0 cites·11 claims
- 0950US10473683B2Sensor element for thermal anemometryBOSCH GMBH ROBERT·Filed 2017·Granted Nov 12, 2019·0 cites·8 claims
- 1047US6655599B2Data carrier having reset means for interrupting the processingKONINKL PHILIPS ELECTRONICS NV·Filed 2001·Granted Dec 2, 2003·2 cites·4 claims
- 1143US11208319B2Method for manufacturing a MEMS unit for a micromechanical pressure sensorBOSCH GMBH ROBERT·Filed 2018·Granted Dec 28, 2021·0 cites·7 claims
- 1243US2011169107A1Method for manufacturing a component, method for manufacturing a component system, component, and component systemKRAMER TORSTEN·Filed 2009·Application pending·0 cites
- 1343US2006271762A1Microcontroller and addressing methodKONINKL PHILIPS ELECTRONICS NV·Filed 2004·Application pending·0 cites
- 1441US8519494B2Method for manufacturing a micromechanical diaphragm structure having access from the rear of the substrateKRAMER TORSTEN·Filed 2009·Granted Aug 27, 2013·0 cites·8 claims
- 1540US10950455B2Method for manufacturing a semiconductor device and semiconductor deviceBOSCH GMBH ROBERT·Filed 2019·Granted Mar 16, 2021·0 cites·11 claims
- 1640US9475693B2ASIC element, in particular as a component of a vertically integrated hybrid componentBOSCH GMBH ROBERT·Filed 2015·Granted Oct 25, 2016·0 cites·9 claims
- 1733US2017081177A1Interposer for mounting a vertically integrated hybrid component on a component carrierBOSCH GMBH ROBERT·Filed 2015·Application pending·0 cites
- 1833US2015353345A1Vertical Hybrid Integrated MEMS ASIC Component Having A Stress Decoupling StructureBOSCH GMBH ROBERT·Filed 2015·Application pending·0 cites
- 1932US6827278B1Data carrierKONINKL PHILIPS ELECTRONICS NV·Filed 1999·Granted Dec 7, 2004·3 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →