Inventor · disambiguated record
Tom Ley
Also filed as: LEY TOM · LEY TOM J
8 granted patents·2 pending applications·155 citations·filing 1991–2012
88Inventor score
Top patents by PatentIndex Score
10 records- 0187US8405187B2Chip package with channel stiffener frameTOSAYA ERIC·Filed 2011·Granted Mar 26, 2013·12 cites·20 claims
- 0284US6512675B1Heat sink grounded to a grounded package lidADVANCED MICRO DEVICES INC·Filed 2001·Granted Jan 28, 2003·43 cites·12 claims
- 0372US6417563B1Spring frame for protecting packaged electronic devicesADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 9, 2002·19 cites·25 claims
- 0471US8008133B2Chip package with channel stiffener frameGLOBALFOUNDRIES INC·Filed 2008·Granted Aug 30, 2011·4 cites·21 claims
- 0563US6362522B1Cool frame for protecting packaged electronic devicesADVANCED MICRO DEVICES INC·Filed 2000·Granted Mar 26, 2002·12 cites·11 claims
- 0659US5249098ASemiconductor device package with solder bump electrical connections on an external surface of the packageLSI LOGIC CORP·Filed 1992·Granted Sep 28, 1993·27 cites·8 claims
- 0758US5500555AMulti-layer semiconductor package substrate with thermally-conductive prepeg layerLSI LOGIC CORP·Filed 1994·Granted Mar 19, 1996·27 cites·5 claims
- 0844US2013258619A1Stiffener frame with circuit board corner protectionLEY TOM J·Filed 2012·Application pending·0 cites
- 0939US5210683ARecessed chip capacitor wells with cleaning channels on integrated circuit packagesLSI LOGIC CORP·Filed 1991·Granted May 11, 1993·11 cites·8 claims
- 1039US2008284047A1Chip Package with Stiffener RingTOSAYA ERIC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →