Inventor · disambiguated record
Toshiki Nakajima
Also filed as: NAKAJIMA TOSHIKI
16 granted patents·10 pending applications·119 citations·filing 1992–2025
90Inventor score
Top patents by PatentIndex Score
26 records- 0191US11804366B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Oct 31, 2023·2 cites·13 claims
- 0281US5705302AColor filter for liquid crystal display device and method for producing the color filterSEIKO EPSON CORP·Filed 1995·Granted Jan 6, 1998·78 cites·22 claims
- 0379US11101114B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2015·Granted Aug 24, 2021·3 cites·6 claims
- 0473US11832373B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 0573US2024049379A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0672US10192774B2Temperature control device for processing target object and method of selectively etching nitride film from multilayer filmTOKYO ELECTRON LTD·Filed 2015·Granted Jan 29, 2019·2 cites·6 claims
- 0766US2025343028A1Plasma processing apparatus and plasma processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0865US11348768B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted May 31, 2022·0 cites·13 claims
- 0964US7365012B2Etching method, a method of forming a trench isolation structure, a semiconductor substrate and a semiconductor apparatusSEIKO EPSON CORP·Filed 2005·Granted Apr 29, 2008·2 cites·17 claims
- 1063US2025343027A1Plasma-processing apparatus and plasma-processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1162US7875557B2Semiconductor substrate treating method, semiconductor component and electronic applianceSEIKO EPSON CORP·Filed 2005·Granted Jan 25, 2011·1 cites·10 claims
- 1259US2021320009A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 1357US11470712B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Oct 11, 2022·0 cites·15 claims
- 1453US2008202559A1Wafer cleaning method and equipmentSEIKO EPSON CORP·Filed 2008·Application pending·0 cites
- 1551US12494344B2Antenna for inductively coupled plasma excitation, antenna unit for inductively coupled plasma excitation, and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 1649US5915049ABinarization system for an image scannerPFU LTD·Filed 1997·Granted Jun 22, 1999·16 cites·4 claims
- 1748US2016260582A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
- 1846US2019131136A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2016·Application pending·0 cites
- 1944US7439183B2Method of manufacturing a semiconductor device, and a semiconductor substrateTOSHIBA KK·Filed 2005·Granted Oct 21, 2008·0 cites·14 claims
- 2043US2005081886A1Wafer cleaning method and equipmentFiled 2004·Application pending·0 cites
- 2140US2006042756A1Semiconductor manufacturing apparatus and chemical exchanging methodMIYAZAKI KUNIHIRO·Filed 2005·Application pending·0 cites
- 2240US2006265743A1Image readerKUSUNOKI TADAKAZU·Filed 2004·Application pending·0 cites
- 2335US5625718AWhite level setting system for an image scannerPFU LTD·Filed 1995·Granted Apr 29, 1997·6 cites·1 claims
- 2434US10950467B2Gas supply mechanism and semiconductor manufacturing systemTOKYO ELECTRON LTD·Filed 2017·Granted Mar 16, 2021·0 cites·17 claims
- 2531US5303230AFault tolerant communication control processorFUJITSU LTD·Filed 1992·Granted Apr 12, 1994·9 cites·19 claims
- 2630US8266236B2Scanner sharing deviceKONISHI NAOTO·Filed 2009·Granted Sep 11, 2012·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →