Inventor · disambiguated record
Toyo Ohashi
Also filed as: OHASHI TOYO
9 granted patents·4 pending applications·8 citations·filing 2014–2024
78Inventor score
Files withMITSUBISHI MATERIALS CORP13
Top patents by PatentIndex Score
13 records- 0177US10798824B2Method for manufacturing insulated circuit board, insulated circuit board, and thermoelectric conversion moduleMITSUBISHI MATERIALS CORP·Filed 2017·Granted Oct 6, 2020·3 cites·15 claims
- 0271US9953944B2Power moduleMITSUBISHI MATERIALS CORP·Filed 2014·Granted Apr 24, 2018·3 cites·17 claims
- 0370US11222835B2Insulating circuit substrate and method for producing insulating circuit substrateMITSUBISHI MATERIALS CORP·Filed 2019·Granted Jan 11, 2022·2 cites·19 claims
- 0468US2025024610A1Bonded body and insulating circuit boardMITSUBISHI MATERIALS CORP·Filed 2024·Application pending·0 cites
- 0559US12137526B2Bonded body and insulating circuit boardMITSUBISHI MATERIALS CORP·Filed 2021·Granted Nov 5, 2024·0 cites·4 claims
- 0651US12177962B2Insulating resin circuit substrateMITSUBISHI MATERIALS CORP·Filed 2021·Granted Dec 24, 2024·0 cites·8 claims
- 0749US12068219B2Heat sink integrated insulating circuit boardMITSUBISHI MATERIALS CORP·Filed 2021·Granted Aug 20, 2024·0 cites·8 claims
- 0849US2025193993A1Insulated circuit board with integrated heat sink, and electronic deviceMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 0948US12133338B2Insulated circuit substrate manufacturing methodMITSUBISHI MATERIALS CORP·Filed 2021·Granted Oct 29, 2024·0 cites·7 claims
- 1046US12108528B2Insulating circuit boardMITSUBISHI MATERIALS CORP·Filed 2020·Granted Oct 1, 2024·0 cites·3 claims
- 1143US2023207333A1Manufacturing method for insulating resin circuit substrateMITSUBISHI MATERIALS CORP·Filed 2021·Application pending·0 cites
- 1243US2023411266A1Heatsink-integrated insulating circuit board and method for manufacturing heatsink-integrated insulating circuit boardMITSUBISHI MATERIALS CORP·Filed 2021·Application pending·0 cites
- 1341US10453783B2Power module substrateMITSUBISHI MATERIALS CORP·Filed 2017·Granted Oct 22, 2019·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →