Inventor · disambiguated record
Tom E. Pearson
Also filed as: PEARSON TOM · PEARSON TOM E
34 granted patents·5 pending applications·471 citations·filing 2000–2019
97Inventor score
Files withINTEL CORP28HEWLETT PACKARD DEVELOPMENT CO2DISHONGH TERRY J1INTEL GE CARE INNOVATIONS LLC1O'SHEA TERRANCE J1
Top patents by PatentIndex Score
39 records- 0191US6501658B2Heatsink mounting with shock absorbersINTEL CORP·Filed 2001·Granted Dec 31, 2002·75 cites·17 claims
- 0289USD456249SPlastic package with pull tabINTEL CORP·Filed 2000·Granted Apr 30, 2002·41 cites·1 claims
- 0387US6734371B2Soldered heat sink anchor and method of useINTEL CORP·Filed 2001·Granted May 11, 2004·36 cites·24 claims
- 0485US6884939B2Constructing of an electronic assembly having a decoupling capacitorINTEL CORP·Filed 2003·Granted Apr 26, 2005·28 cites·13 claims
- 0583US6509530B2Via intersect pad for electronic components and methods of manufactureINTEL CORP·Filed 2001·Granted Jan 21, 2003·24 cites·22 claims
- 0680US7122891B2Ceramic embedded wireless antennaINTEL CORP·Filed 2003·Granted Oct 17, 2006·32 cites·16 claims
- 0779US7036217B2Methods of manufacturing via intersect pad for electronic componentsINTEL CORP·Filed 2003·Granted May 2, 2006·14 cites·27 claims
- 0878US7183496B2Soldered heat sink anchor and method of useINTEL CORP·Filed 2004·Granted Feb 27, 2007·18 cites·15 claims
- 0976US6903271B2Electronic assembly with thermally separated supportINTEL CORP·Filed 2003·Granted Jun 7, 2005·18 cites·23 claims
- 1074US7161238B2Structural reinforcement for electronic substrateINTEL CORP·Filed 2002·Granted Jan 9, 2007·17 cites·27 claims
- 1173US6801436B2Extension mechanism and method for assembling overhanging componentsINTEL CORP·Filed 2001·Granted Oct 5, 2004·14 cites·11 claims
- 1273US6764325B2Zero insertion force heat-activated retention pinINTEL CORP·Filed 2002·Granted Jul 20, 2004·17 cites·29 claims
- 1371US6747873B1Channeled heat dissipation device and a method of fabricationINTEL CORP·Filed 2003·Granted Jun 8, 2004·15 cites·8 claims
- 1470US6700800B2Retainer for circuit board assembly and method for using the sameINTEL CORP·Filed 2002·Granted Mar 2, 2004·15 cites·9 claims
- 1570US6472612B2Printed circuit board with embedded thermocouple junctionsINTEL CORP·Filed 2001·Granted Oct 29, 2002·17 cites·25 claims
- 1669US9263621B2Inclined photonic chip package for integrated optical transceivers and optical touchscreen assembliesVREMAN GERRIT J·Filed 2013·Granted Feb 16, 2016·3 cites·17 claims
- 1767US7251880B2Method and structure for identifying lead-free solderINTEL CORP·Filed 2001·Granted Aug 7, 2007·12 cites·29 claims
- 1867US6875931B2Retainer for circuit board assembly and method for using the sameINTEL CORP·Filed 2002·Granted Apr 5, 2005·14 cites·21 claims
- 1964US9420700B2Inclined photonic chip package for integrated optical transceivers and optical touchscreen assembliesINTEL CORP·Filed 2015·Granted Aug 16, 2016·1 cites·20 claims
- 2064US6906921B2Channeled heat dissipation device and a method of fabricationINTEL CORP·Filed 2004·Granted Jun 14, 2005·10 cites·5 claims
- 2162US7230317B2Capacitor placement for integrated circuit packagesINTEL CORP·Filed 2004·Granted Jun 12, 2007·11 cites·21 claims
- 2260US8901476B2Temporal based motion sensor reportingINTEL GE CARE INNOVATIONS LLC·Filed 2013·Granted Dec 2, 2014·1 cites·17 claims
- 2358US7185799B2Method of creating solder bar connections on electronic packagesINTEL CORP·Filed 2004·Granted Mar 6, 2007·8 cites·12 claims
- 2458US6651869B2Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave solderingINTEL CORP·Filed 2001·Granted Nov 25, 2003·7 cites·32 claims
- 2555US6791189B2Epoxy washer for retention of inverted SMT componentsINTEL CORP·Filed 2002·Granted Sep 14, 2004·5 cites·18 claims
- 2655US6691407B2Methods for retaining assembled componentsINTEL CORP·Filed 2001·Granted Feb 17, 2004·5 cites·14 claims
- 2754US6917524B2Extension mechanism and method for assembling overhanging componentsINTEL CORP·Filed 2004·Granted Jul 12, 2005·4 cites·13 claims
- 2853US8525099B2Temporal based motion sensor reportingO'SHEA TERRANCE J·Filed 2010·Granted Sep 3, 2013·1 cites·22 claims
- 2953US7131193B2Heat-shrinkable retainer for PCB double-sided assemblyINTEL CORP·Filed 2004·Granted Nov 7, 2006·3 cites·16 claims
- 3051US9367174B2Wireless peripheral data transmission for touchscreen displaysROBERTS RICHARD D·Filed 2014·Granted Jun 14, 2016·0 cites·20 claims
- 3149US11046496B2Protective device for electronic deviceHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Jun 29, 2021·0 cites·19 claims
- 3249US6906268B2Heat-shrinkable retainer for PCB double-sided assemblyINTEL CORP·Filed 2001·Granted Jun 14, 2005·2 cites·26 claims
- 3347US10063074B2Electronic wearable device electrode pad with collection wellHEWLETT PACKARD DEVELOPMENT CO·Filed 2016·Granted Aug 28, 2018·0 cites·20 claims
- 3445US2005090041A1Constructing of an electronic assembly having a decoupling capacitorFiled 2004·Application pending·0 cites
- 3544US6817878B2Zero mounting force solder-free connector/component and methodINTEL CORP·Filed 2001·Granted Nov 16, 2004·3 cites·16 claims
- 3644US2021080262A1Self-seating system and methodOSHEA TERRANCE J·Filed 2019·Application pending·0 cites
- 3740US2006109121A1RFID embedded in deviceDISHONGH TERRY J·Filed 2004·Application pending·0 cites
- 3838US2005218035A1Infrared transmissive integrated circuit socket capPEARSON TOM E·Filed 2004·Application pending·0 cites
- 3934US2004124006A1Built up landsFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →