Inventor · disambiguated record
Toyokazu Sakata
Also filed as: SAKATA TOYOKAZU
10 granted patents·2 pending applications·50 citations·filing 2000–2015
87Inventor score
Top patents by PatentIndex Score
12 records- 0171US6790761B2Method of fabricating a semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2003·Granted Sep 14, 2004·15 cites·21 claims
- 0268US9761479B2Manufacturing method for semiconductor substrateTOYOTA JIDOSHOKKI KK·Filed 2014·Granted Sep 12, 2017·2 cites·16 claims
- 0366US7713863B2Method for manufacturing a semiconductor device and method for etching the sameOKI SEMICONDUCTOR CO LTD·Filed 2008·Granted May 11, 2010·3 cites·10 claims
- 0465US6930035B2Semiconductor device fabrication methodOKI ELECTRIC IND CO LTD·Filed 2003·Granted Aug 16, 2005·13 cites·10 claims
- 0563US9773678B2Semiconductor substrate and method for manufacturing semiconductor substrateTOYOTA JIDOSHOKKI KK·Filed 2015·Granted Sep 26, 2017·1 cites·19 claims
- 0659US7338881B2Method for manufacturing semiconductor elementOKI ELECTRIC IND CO LTD·Filed 2005·Granted Mar 4, 2008·2 cites·10 claims
- 0752US7300882B2Etching method and semiconductor device fabricating methodOKI ELECTRIC IND CO LTD·Filed 2003·Granted Nov 27, 2007·4 cites·14 claims
- 0850US6825566B1Semiconductor device with reduced interconnection capacityOKI ELECTRIC IND CO LTD·Filed 2000·Granted Nov 30, 2004·6 cites·11 claims
- 0947US7015137B2Semiconductor device with reduced interconnection capacityOKI ELECTRIC IND CO LTD·Filed 2004·Granted Mar 21, 2006·4 cites·7 claims
- 1044US2006205208A1Method for manufacturing a semiconductor device and method for etching the sameOKI ELECTRIC IND CO LTD·Filed 2005·Application pending·0 cites
- 1142US2007072403A1Semiconductor device and method for fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2006·Application pending·0 cites
- 1241US7566617B2Method for manufacturing semiconductor elemental device forming an amorphous high dielectric film and an amorphous silicon filmOKI SEMICONDUCTOR CO LTD·Filed 2006·Granted Jul 28, 2009·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →