Inventor · disambiguated record
Toshihisa Sato
Also filed as: SATO TOSHIHISA
11 granted patents·10 pending applications·107 citations·filing 1997–2023
89Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES11FUJITSU LTD7KURASHIKI BOSEKI KK1SATO TOSHIHISA1TOYOTA MOTOR CO LTD1
Top patents by PatentIndex Score
21 records- 0195US10007078B2Optical fiber ribbonSUMITOMO ELECTRIC INDUSTRIES·Filed 2016·Granted Jun 26, 2018·16 cites·11 claims
- 0292US7299965B2Method and apparatus for mounting and removing an electronic componentFUJITSU LTD·Filed 2005·Granted Nov 27, 2007·17 cites·6 claims
- 0385US12379558B2Optical fiber ribbon and sub-tape-type optical fiber ribbonSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Aug 5, 2025·1 cites·6 claims
- 0482US10640122B2Driving consciousness estimation deviceTOYOTA MOTOR CO LTD·Filed 2017·Granted May 5, 2020·7 cites·8 claims
- 0580US8689952B2DamperSATO TOSHIHISA·Filed 2011·Granted Apr 8, 2014·8 cites·6 claims
- 0668US6028976ASplit type ribbon optical fiber core cableSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Feb 22, 2000·33 cites·9 claims
- 0765US6898356B2Split type optical fiber tape coreSUMITOMO ELECTRIC INDUSTRIES·Filed 2002·Granted May 24, 2005·7 cites·7 claims
- 0860US12321027B2Optical fiber ribbonSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Jun 3, 2025·0 cites·4 claims
- 0957US2025298206A1Optical fiber ribbonSUMITOMO ELECTRIC INDUSTRIES·Filed 2023·Application pending·0 cites
- 1053US2006196912A1Method and apparatus for mounting and removing an electronic componentFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1151US2007012477A1Electronic component package including joint material having higher heat conductivityFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1247US2018282208A1Method for manufacturing optical fiberSUMITOMO ELECTRIC INDUSTRIES·Filed 2018·Application pending·0 cites
- 1345US5945173AMethod of making optical fiber ribbonSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted Aug 31, 1999·12 cites·5 claims
- 1444US2019121044A1Method and apparatus for manufacturing optical fiber ribbonSUMITOMO ELECTRIC INDUSTRIES·Filed 2017·Application pending·0 cites
- 1542US2008006915A1Semiconductor package, method of production of same, printed circuit board, and electronic apparatusFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1642US2007228530A1Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreaderFUJITSU LTD·Filed 2006·Application pending·0 cites
- 1740US2007018310A1Semiconductor device and manufacturing method thereofFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1836US5904883AMethod for producing optical fiber ribbonSUMITOMO ELECTRIC INDUSTRIES·Filed 1997·Granted May 18, 1999·6 cites·9 claims
- 1934US2008002374A1Substrate with stiffener and manufacturing method thereofFUJITSU LTD·Filed 2006·Application pending·0 cites
- 2033US2021025698A1Device and Method for Three-dimensionally Measuring Linear ObjectKURASHIKI BOSEKI KK·Filed 2019·Application pending·0 cites
- 2127US6471892B1Method of producing tape type optical fiber core wireSUMITOMO ELECTRIC INDUSTRIES·Filed 1998·Granted Oct 29, 2002·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →