Method and apparatus for mounting and removing an electronic component

Abstract

A method and an apparatus are provided for mounting and removing electronic components using solder bumps while constraining thermal stresses to a substrate. The method and apparatus for mounting and removing an electronic component (bear chip 32 ) to be soldered onto the substrate with solder bumps 114 is configured to move the electronic component to detect contact of the solder bumps with the substrate or contact of a tool (chuck unit 38 ) with the electronic component, to define the contact as an original point for raising a heating temperature of the electronic component and the substrate from the heating temperature to a maximum heating temperature HTm as well as move the electronic component in conformity with the temperature rising, and to move the electronic component from a position where the maximum heating temperature is achieved to a mounting height of the substrate.

1 . A mounting apparatus for an electronic component to be mounted onto a substrate via solder bumps, the mounting apparatus comprising: 
 a movement mechanism moving the electronic component;    a heating unit heating the electronic component or the substrate;    a contact detection unit detecting contact of the solder bumps of the electronic component with the substrate; and    a control unit moving the electronic component via the movement mechanism, the control unit raising a heating temperature of the heating unit for the electronic component and the substrate up to a maximum heating temperature starting from the detection of contact by the contact detection unit as well as moving the electronic component responding to the temperature rising through the movement mechanism, the control unit moving the electronic component from a position where the maximum heating temperature is achieved to a mounting height of the substrate.    
   
   
       2 . A removing apparatus for an electronic component mounted on a substrate with the use of solder bumps, the removing apparatus comprising: 
 a heating unit heating a tool supporting the electronic component or heating at least a soldered portion of the electronic component;    a contact detection unit detecting contact of the tool with the electronic component on the substrate;    a movement mechanism for moving the tool; and    a control unit moving the tool via the movement mechanism to detect the contact by use of the contact detection unit, the control unit raising a heating temperature for the electronic component and the substrate via the heating unit up to a maximum heating temperature starting from the contact, the control unit moving the tool via the movement mechanism responding to the temperature rising, the control unit moving the electronic component through movement of the tool from a position where the maximum heating temperature is achieved to a mounting height of the substrate so that the tool receives the electronic component from the substrate.