Inventor · disambiguated record
Tomoyuki Shimodaira
Also filed as: SHIMODAIRA TOMOYUKI
14 granted patents·5 pending applications·17 citations·filing 2009–2025
86Inventor score
Top patents by PatentIndex Score
19 records- 0188US9918378B1Wiring substrateSHINKO ELECTRIC IND CO·Filed 2017·Granted Mar 13, 2018·7 cites·8 claims
- 0272US9711476B2Wiring board and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted Jul 18, 2017·2 cites·19 claims
- 0372US8450852B2Wiring substrateKONDO HITOSHI·Filed 2011·Granted May 28, 2013·4 cites·14 claims
- 0468US9232641B2Wiring board and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2013·Granted Jan 5, 2016·2 cites·5 claims
- 0565US11574866B2Wiring substrate and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2021·Granted Feb 7, 2023·0 cites·7 claims
- 0664US12418981B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2022·Granted Sep 16, 2025·0 cites·11 claims
- 0764US12342457B2Wiring board and manufacturing method of wiring boardSHINKO ELECTRIC IND CO·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 0864US8669478B2Wiring substrate and method of manufacturing the sameKONDO HITOSHI·Filed 2011·Granted Mar 11, 2014·2 cites·10 claims
- 0963US2025113438A1Wiring board and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2024·Application pending·0 cites
- 1062US11211326B2Wiring substrate and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2020·Granted Dec 28, 2021·0 cites·10 claims
- 1161US12191255B2Interconnect substrate having groove around padSHINKO ELECTRIC IND CO·Filed 2022·Granted Jan 7, 2025·0 cites·9 claims
- 1256US11001930B2Method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2020·Granted May 11, 2021·0 cites·9 claims
- 1356US2025374704A1Interconnect substrate and method of making the sameSHINKO ELECTRIC IND CO·Filed 2025·Application pending·0 cites
- 1451US10643934B2Wiring substrate and electronic component deviceSHINKO ELECTRIC IND CO·Filed 2019·Granted May 5, 2020·0 cites·11 claims
- 1546US2009288870A1Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Application pending·0 cites
- 1644US2011290536A1Wiring substrateKANEKO KENTARO·Filed 2011·Application pending·0 cites
- 1741US9699912B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2016·Granted Jul 4, 2017·0 cites·19 claims
- 1839US9893002B2Terminal structure and wiring substrateSHINKO ELECTRIC IND CO·Filed 2016·Granted Feb 13, 2018·0 cites·10 claims
- 1938US2011297425A1Wiring substrate and manufacturing method thereofNAKAMURA JUNICHI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →