Inventor · disambiguated record
Tomonori Shinoda
Also filed as: SHINODA TOMONORI
8 granted patents·3 pending applications·82 citations·filing 2004–2014
85Inventor score
Top patents by PatentIndex Score
11 records- 0190US7935574B2Marking method and sheet for both protective film forming and dicingLINTEC CORP·Filed 2005·Granted May 3, 2011·32 cites·12 claims
- 0282US9786541B2Dicing sheet with protective film forming layer and chip fabrication methodLINTEC CORP·Filed 2012·Granted Oct 10, 2017·7 cites·10 claims
- 0382US8034667B2Semiconductor sealing resin sheet and semiconductor device manufacturing method using the sameLINTEC CORP·Filed 2005·Granted Oct 11, 2011·12 cites·3 claims
- 0476US7135358B2Process for producing resin-sealed type electronic deviceLINTEC CORP·Filed 2004·Granted Nov 14, 2006·23 cites·20 claims
- 0575US9443750B2Dicing sheet with protective film-forming layer, and method for producing chipLINTEC CORP·Filed 2012·Granted Sep 13, 2016·3 cites·11 claims
- 0668US8735881B1Resin film forming sheet for chip, and method for manufacturing semiconductor chipLINTEC CORP·Filed 2014·Granted May 27, 2014·2 cites·8 claims
- 0766US8674349B2Resin film forming sheet for chip, and method for manufacturing semiconductor chipSHINODA TOMONORI·Filed 2011·Granted Mar 18, 2014·3 cites·10 claims
- 0843US2009053518A1Sheet for Forming a Protective Film for ChipsLINTEC CORP·Filed 2007·Application pending·0 cites
- 0942US2010025837A1Composite semiconductor device, semiconductor package and spacer sheet used in the same, and method for manufacturing composite semiconductor deviceLINTEC CORP·Filed 2007·Application pending·0 cites
- 1042US2010090323A1Composite type semiconductor device spacer sheet, semiconductor package using the same, composite type semiconductor device manufacturing method, and composite type semiconductor deviceLINTEC CORP·Filed 2007·Application pending·0 cites
- 1138US9754811B2Dicing sheet with protective film forming layer and method for producing chipLINTEC CORP·Filed 2013·Granted Sep 5, 2017·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →