Inventor · disambiguated record
Toshiaki Shirasaka
Also filed as: SHIRASAKA TOSHIAKI
5 granted patents·12 pending applications·13 citations·filing 2005–2023
71Inventor score
Top patents by PatentIndex Score
17 records- 0191US10035099B2CO2 removal deviceHITACHI CHEMICAL CO LTD·Filed 2015·Granted Jul 31, 2018·9 cites·16 claims
- 0261US8138268B2Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2005·Granted Mar 20, 2012·2 cites·13 claims
- 0356US9349931B2Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED deviceNISHIYAMA TOMOO·Filed 2012·Granted May 24, 2016·2 cites·24 claims
- 0454US10456731B2CO2 concentration reducing deviceHITACHI CHEMICAL CO LTD·Filed 2016·Granted Oct 29, 2019·0 cites·9 claims
- 0552US2025336881A1Method for manufacturing semiconductor deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0651US8309658B2Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor deviceKATOGI SHIGEKI·Filed 2011·Granted Nov 13, 2012·0 cites·10 claims
- 0749US2016220943A1Carbon-dioxide recovery apparatus, and carbon-dioxide recovery methodHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 0847US2024170447A1Semiconductor device manufacturing method, semiconductor device, integrated circuit element, and integrated circuit element manufacturing methodRESONAC CORP·Filed 2022·Application pending·0 cites
- 0947US2016199808A1Carbon-dioxide capturing material, and carbon-dioxide recovery apparatus using sameHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 1047US2024170475A1Method for manufacturing semiconductor device, semiconductor device, integrated circuit element, and method for manufacturing integrated circuit elementRESONAC CORP·Filed 2022·Application pending·0 cites
- 1147US2024321818A1Method for manufacturing semiconductor device, cleaning device, cleaning method, and semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 1244US2024347436A1Method for producing semiconductor device, and semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 1343US2018237549A1Composite material, photosensitive resin composition for solder resist, and photosensitive elementHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 1442US2018237599A1Curable resin composition, composition for molding, resin molded article, and method for producing resin molded articleHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 1542US2012048606A1Adhesive composition, film-like adhesive, and connection structure for circuit memberIZAWA HIROYUKI·Filed 2008·Application pending·0 cites
- 1639US2019062480A1Curable-resin composition and cured object thereofHITACHI CHEMICAL CO LTD·Filed 2016·Application pending·0 cites
- 1730US2014079913A1Multilayer resin sheet, resin sheet laminate, cured multilayer resin sheet and method for producing same, multilayer resin sheet with metal foil, and semiconductor deviceNISHIYAMA TOMOO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →