Inventor · disambiguated record
Tomoya Tsukui
Also filed as: TSUKUI Tomoya
4 granted patents·1 pending application·4 citations·filing 2014–2021
60Inventor score
Technology areasH10P
Top patents by PatentIndex Score
5 records- 0170US9963622B2Heat-resistant adhesive sheet for semiconductor testingDENKA COMPANY LTD·Filed 2014·Granted May 8, 2018·3 cites·8 claims
- 0261US9934997B2Adhesive sheet and method of manufacturing electronic componentDENKA COMPANY LTD·Filed 2015·Granted Apr 3, 2018·1 cites·5 claims
- 0348US12243766B2Back grinding adhesive sheet, and method for manufacturing semiconductor waferDISCO CORP·Filed 2020·Granted Mar 4, 2025·0 cites·13 claims
- 0446US12312512B2Adhesive sheet for backgrinding and production method for semiconductor waferDISCO CORP·Filed 2020·Granted May 27, 2025·0 cites·5 claims
- 0539US2023230870A1Wafer processing sheet and wafer processing methodDENKA COMPANY LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →