Inventor · disambiguated record
Tsung-Hung Chang
Also filed as: CHANG TSUNG-HUNG
11 granted patents·4 pending applications·56 citations·filing 2009–2018
87Inventor score
Files withUNITED MICROELECTRONICS CORP11CHANG TSUNG-HUNG1GUO TED MING-LANG1UNITED MICROELECTRONIS CORP1WANG I-CHANG1
Top patents by PatentIndex Score
15 records- 0196US9263392B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2014·Granted Feb 16, 2016·25 cites·24 claims
- 0289US8502288B2Semiconductor structure and method for slimming spacerGUO TED MING-LANG·Filed 2011·Granted Aug 6, 2013·11 cites·7 claims
- 0387US9324610B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 26, 2016·9 cites·18 claims
- 0472US9984974B1Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layerUNITED MICROELECTRONICS CORP·Filed 2018·Granted May 29, 2018·1 cites·6 claims
- 0572US9318571B2Gate structure and method for trimming spacersWANG I-CHANG·Filed 2009·Granted Apr 19, 2016·6 cites·8 claims
- 0666US9466521B2Semiconductor device having a patterned metal layer embedded in an interlayer dielectric layerUNITED MICROELECTRONICS CORP·Filed 2014·Granted Oct 11, 2016·1 cites·8 claims
- 0763US8841193B2Semiconductor structure and method for slimming spacerUNITED MICROELECTRONICS CORP·Filed 2013·Granted Sep 23, 2014·1 cites·13 claims
- 0862US9312121B1Method for cleaning contact hole and forming contact plug thereinUNITED MICROELECTRONICS CORP·Filed 2014·Granted Apr 12, 2016·1 cites·9 claims
- 0955US9899322B2Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layerUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 20, 2018·0 cites·14 claims
- 1055US9105651B2Method of fabricating a MOS device using a stress-generating materialUNITED MICROELECTRONICS CORP·Filed 2013·Granted Aug 11, 2015·1 cites·8 claims
- 1150US2014131804A1Semiconductor structureUNITED MICROELECTRONIS CORP·Filed 2012·Application pending·0 cites
- 1248US2016260613A1Manufacturing method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 1347US9564371B2Method for forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2014·Granted Feb 7, 2017·0 cites·16 claims
- 1445US2016071800A1Semiconductor structure and process thereofUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1535US2012196421A1Stress adjusting methodCHANG TSUNG-HUNG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →