Inventor · disambiguated record
Tsung-Yu Chen
Also filed as: CHEN TSUNG Y · CHEN TSUNG-YU
78 granted patents·63 pending applications·841 citations·filing 1993–2025
99Inventor score
Top patents by PatentIndex Score
141 records- 0199US9869934B2Collector in an extreme ultraviolet lithography system with optimal air curtain protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·148 cites·20 claims
- 0298US11594469B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 28, 2023·6 cites·20 claims
- 0398US11282825B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·5 cites·20 claims
- 0496US11810833B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·3 cites·20 claims
- 0595US11929293B2Semiconductor package with lid structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 0695US11062971B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·12 cites·20 claims
- 0795US10461014B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·10 cites·23 claims
- 0894US11923310B2Package structure including through via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·2 cites·20 claims
- 0994US10867885B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·8 cites·20 claims
- 1093US11756870B2Stacked via structure disposed on a conductive pillar of a semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·2 cites·20 claims
- 1193US10483187B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 19, 2019·7 cites·20 claims
- 1293US10269682B2Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·9 cites·21 claims
- 1392US9377693B2Collector in an extreme ultraviolet lithography system with optimal air curtain protectionTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 28, 2016·10 cites·20 claims
- 1491US11302600B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 12, 2022·5 cites·19 claims
- 1591US10515867B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·6 cites·17 claims
- 1690US10978373B2Semiconductor device methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·5 cites·19 claims
- 1790US10790254B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 29, 2020·6 cites·20 claims
- 1889US10985125B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 20, 2021·2 cites·20 claims
- 1989US6569063B2Magnets adjusting device for bike exercisersFiled 2001·Granted May 27, 2003·42 cites·3 claims
- 2087US11088079B2Package structure having line connected via portionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·4 cites·20 claims
- 2187US11018073B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·3 cites·20 claims
- 2287USD519583STreading exercise machineCHEN TSUNG-YU·Filed 2004·Granted Apr 25, 2006·36 cites·1 claims
- 2386US6315697B1Stepping exerciser having depth adjustable pedalsFiled 2000·Granted Nov 13, 2001·49 cites·3 claims
- 2485USD496700STreadling exerciserFiled 2003·Granted Sep 28, 2004·30 cites·1 claims
- 2584US10524392B1Dissipating heat using phase change materialINTEL CORP·Filed 2018·Granted Dec 31, 2019·4 cites·15 claims
- 2684US10153218B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 11, 2018·4 cites·20 claims
- 2784US9665007B2Rotary EUV collectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·2 cites·20 claims
- 2884US2025069980A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2983US12387988B2Method of manufacturing semiconductor package having lid structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 3082US11088048B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 3182US10867884B2Heat spreading device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·2 cites·20 claims
- 3282US2025309009A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3381US12170237B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 3481US2025357447A1Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3580US5290214AExerciserCHEN TSUNG YU·Filed 1993·Granted Mar 1, 1994·64 cites·4 claims
- 3680US2025096092A1Stacked via structure disposed on a conductive pillar of a semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3779US12021006B2Package structure and method and equipment for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 3879US11004771B2Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·2 cites·20 claims
- 3979US6712739B1Stair climbing exerciserFiled 2003·Granted Mar 30, 2004·29 cites·2 claims
- 4079US2025349652A1Package assembly with back plate compressionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4179US2024363611A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4279US2025349668A1Packages with liquid metal as heat-dissipation media and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4379US2024387315A1Semiconductor package module and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4478US12191239B2Stacked via structure disposed on a conductive pillar of a semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 4578US12125757B2Semiconductor package with stiffener structure and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 4678USD480119SStationary bicycleFiled 2002·Granted Sep 30, 2003·23 cites·1 claims
- 4778US2025357258A1Electronic apparatus, semiconductor package module and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4877US6918857B2Exercising stepperFiled 2003·Granted Jul 19, 2005·28 cites·4 claims
- 4977US2025357261A1Package structure with molding layer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 5076US12272612B2Semiconductor package module and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
Showing the top 50 of 141 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →