Inventor · disambiguated record
Tsao-Pin Chen
Also filed as: CHEN TSAO-PIN
5 granted patents·16 citations·filing 2009–2011
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0179US8390087B2Image sensor package structure with large air cavityTU HSIU-WEN·Filed 2010·Granted Mar 5, 2013·7 cites·13 claims
- 0270US8093674B2Manufacturing method for molding image sensor package structure and image sensor package structure thereofTU HSIU-WEN·Filed 2009·Granted Jan 10, 2012·5 cites·11 claims
- 0367US8847146B2Image sensor package structure with casing including a vent without sealing and in communication with package materialTU HSIU-WEN·Filed 2009·Granted Sep 30, 2014·4 cites·7 claims
- 0445US8828777B2Wafer level image sensor packaging structure and manufacturing method of the sameTU HSIU-WEN·Filed 2011·Granted Sep 9, 2014·0 cites·16 claims
- 0545US8378441B2Manufacturing method and structure of a wafer level image sensor module with package structureKINGPAK TECH INC·Filed 2011·Granted Feb 19, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →