Inventor · disambiguated record
Tsung-Hsien Chiang
Also filed as: CHIANG TSUNG-HSIEN
51 granted patents·11 pending applications·108 citations·filing 2011–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD51TAIWAN SEMICONDUCTOR MFG3ATOMIC ENERGY COUNCIL—INST OF NUCLEAR ENERGY RES2LIU SHOW-WEN2ATOMIC ENERGY COUNCIL-INSTITUTE OF NUCLEAR ENERGY RES1
Top patents by PatentIndex Score
62 records- 0197US11227837B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 18, 2022·5 cites·20 claims
- 0297US11158576B2Package structure having redistribution layer structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 26, 2021·4 cites·20 claims
- 0395US11004786B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·10 cites·20 claims
- 0495US10832985B2Sensor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·12 cites·20 claims
- 0594US11929318B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 0694US8829673B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 9, 2014·17 cites·20 claims
- 0792US9870997B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·6 cites·20 claims
- 0891US11502039B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 0990US11742254B2Sensor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 29, 2023·2 cites·20 claims
- 1090US10515900B2Chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·3 cites·20 claims
- 1189US10784203B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·5 cites·20 claims
- 1288US10157846B2Method for forming chip package involving cutting processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·3 cites·20 claims
- 1387US11942433B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·1 cites·20 claims
- 1487US11404381B2Chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·2 cites·20 claims
- 1586US12362274B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 1686US9397059B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·4 cites·20 claims
- 1785US9735087B2Wafer level embedded heat spreaderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 15, 2017·6 cites·20 claims
- 1885US9659896B2Interconnect structures for wafer level package and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 23, 2017·4 cites·20 claims
- 1985US2025273565A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2084US12261126B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 25, 2025·0 cites·20 claims
- 2183US12362329B2Method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 2283US12334434B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 2383US9673161B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 6, 2017·3 cites·20 claims
- 2481US12266639B2Method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 2581US12125797B2Package structure with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
- 2680US10276509B2Integrated fan-out packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·20 claims
- 2779US2025357246A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2878US11133269B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·2 cites·19 claims
- 2978US8753015B2Crossed-roller bearingKUO CHANG-HSIN·Filed 2011·Granted Jun 17, 2014·5 cites·18 claims
- 3078US2025192112A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3177US12080653B2Formation method of chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 3276US2024395721A1Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3376US2025329665A1Dielectric Slots Underneath Conductive Vias in Interconnect Structure of Semiconductor Package and Method of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3475US11088102B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·1 cites·20 claims
- 3574US12159839B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 3674US2025299973A1Staggered metal mesh on backside of device die and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3773US11935871B2Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·20 claims
- 3873US11107772B2Semiconductor package and method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·1 cites·20 claims
- 3972US11923318B2Method of manufacturing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 4071US10468366B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·1 cites·20 claims
- 4168US12438007B2Staggered metal mesh on backside of device die and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 4268US12406941B2Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 4366US9123788B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 1, 2015·1 cites·20 claims
- 4465US8746409B2Linear transmission assembly having lubricant recovery moduleCHIANG TSUNG-HSIEN·Filed 2011·Granted Jun 10, 2014·3 cites·9 claims
- 4565US2023420331A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4664US12205860B2Sensor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 4761US10269676B2Thermally enhanced package-on-package (PoP)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Apr 23, 2019·1 cites·20 claims
- 4860US11101192B2Wafer level embedded heat spreaderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·0 cites·20 claims
- 4957US10177073B2Wafer level embedded heat spreaderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 5056US10867911B2InFO coil structure and methods of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 15, 2020·0 cites·19 claims
Showing the top 50 of 62 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →