Inventor · disambiguated record
Tse-An Chu
Also filed as: CHU TSE-AN · CHU TSE-AN GINO
9 granted patents·3 pending applications·7 citations·filing 2010–2023
78Inventor score
Top patents by PatentIndex Score
12 records- 0181US11320885B2Wide range power mechanism for over-speed memory designDELL PRODUCTS LP·Filed 2020·Granted May 3, 2022·2 cites·18 claims
- 0277US11188130B2Method and apparatus for thermal management using different customization modesDELL PRODUCTS LP·Filed 2019·Granted Nov 30, 2021·2 cites·18 claims
- 0364US11755094B2Wide range power mechanism for over-speed memory designDELL PRODUCTS LP·Filed 2022·Granted Sep 12, 2023·0 cites·18 claims
- 0464US8305758B2Heat-dissipating moduleCHU TSE-AN·Filed 2010·Granted Nov 6, 2012·3 cites·10 claims
- 0560US12393239B2Method and apparatus for an embedded controller (EC) used to identify different installed cooling fan types and operating performance configurationsDELL PRODUCTS LP·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 0657US11669143B2Managing a dynamic total power level for an information handling systemDELL PRODUCTS LP·Filed 2021·Granted Jun 6, 2023·0 cites·18 claims
- 0748US11137782B2System and method for controlling a dynamic voltage regulator slew rate in an information handling systemDELL PRODUCTS LP·Filed 2019·Granted Oct 5, 2021·0 cites·16 claims
- 0843US2014076529A1Heat dissipation structureHUNG JIA-YU·Filed 2013·Application pending·0 cites
- 0942US10859326B2Fin stack for processor coolingDELL PRODUCTS LP·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
- 1040US2017034901A1Heat dissipation structureHUNG JIA-YU·Filed 2016·Application pending·0 cites
- 1132US10936028B2Electronic device having a deformation sensor on a fan module of a fan and using a controller to monitor the deformation sensor and control operation of the fan based on a deformation signal of the sensorCHIEN CHIH CHIN·Filed 2017·Granted Mar 2, 2021·0 cites·10 claims
- 1228US2019059177A1Heat dissipation module and electronic deviceCHU TSE AN·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →