Heat dissipation structure

Abstract

A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.

What is claimed is: 
     
         1 . A heat dissipation structure suitable to reduce the temperature of a casing of an electronic device, comprising:
 a first heat-conducting sheet;   a second heat-conducting sheet; and   a meshed heat-conducting layer, disposed between the first heat-conducting sheet and the second heat-conducting sheet, wherein the meshed heat-conducting layer comprises a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.   
     
     
         2 . The heat dissipation structure as claimed in  claim 1 , wherein the meshed heat-conducting layer has a plurality of first holes, the first heat-conducting mediums are air in the first holes so as to form a plurality of air pillars in the meshed heat-conducting layer, and the second heat-conducting mediums form physical entity of the meshed heat-conducting layer excluding the first holes. 
     
     
         3 . The heat dissipation structure as claimed in  claim 2 , wherein the shape of each of the first holes is cycle, ellipse, rectangle, trapezoid or triangle. 
     
     
         4 . The heat dissipation structure as claimed in  claim 1 , wherein the electronic device further has a heat-generating component, and the heat dissipation structure is disposed between the heat-generating component and the casing. 
     
     
         5 . The heat dissipation structure as claimed in  claim 4 , wherein the second heat-conducting sheet is located between the heat-generating component and the first heat-conducting sheet, and the thickness of the second heat-conducting sheet is greater than the thickness of the first heat-conducting sheet. 
     
     
         6 . The heat dissipation structure as claimed in  claim 4 , further comprising a glue layer, wherein the glue layer is adhered between the first heat-conducting sheet and the casing, the second heat-conducting sheet faces the heat-generating component and the second heat-conducting sheet and the heat-generating component are separated by an interval. 
     
     
         7 . The heat dissipation structure as claimed in  claim 6 , wherein the glue layer comprises a plurality of third heat-conducting mediums and a plurality of fourth heat-conducting mediums, the third heat-conducting mediums and the fourth heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the third heat-conducting mediums is less than the thermal conductivity of each of the fourth heat-conducting mediums. 
     
     
         8 . The heat dissipation structure as claimed in  claim 7 , wherein the glue layer further has a plurality of second holes, the third heat-conducting mediums are air in the second holes so as to form a plurality of air pillars in the glue layer, and the fourth heat-conducting mediums form physical entity of the glue layer excluding the second holes. 
     
     
         9 . The heat dissipation structure as claimed in  claim 6 , wherein when the casing is a metallic material or there is a conductive layer at the contact position between the casing and the glue layer, the glue layer is a conductive glue. 
     
     
         10 . The heat dissipation structure as claimed in  claim 4 , further comprising a thermal glue, wherein the thermal glue is adhered between the second heat-conducting sheet and the heat-generating component, the first heat-conducting sheet faces the casing and the first heat-conducting sheet and the casing are separated by an interval. 
     
     
         11 . The heat dissipation structure as claimed in  claim 4 , further comprising an insulation layer, wherein the heat-generating component is disposed on a circuit board, a surface of the second heat-conducting sheet faces the circuit board and the insulation layer is disposed on the surface of the second heat-conducting sheet. 
     
     
         12 . The heat dissipation structure as claimed in  claim 1 , wherein the materials of the first heat-conducting sheet and the second heat-conducting sheet are metal or ceramic and the first heat-conducting sheet and the second heat-conducting sheet are parallel to each other. 
     
     
         13 . The heat dissipation structure as claimed in  claim 1 , wherein the meshed heat-conducting layer is a glue layer. 
     
     
         14 . The heat dissipation structure as claimed in  claim 1 , wherein the glue layer is a patch-type glue layer. 
     
     
         15 . A heat dissipation structure suitable to reduce the temperature of a casing of an electronic device, comprising:
 a first heat-conducting sheet;   a second heat-conducting sheet; and   a meshed heat-conducting layer, adhered between the first heat-conducting sheet and the second heat-conducting sheet, wherein the meshed heat-conducting layer has a plurality of first holes to form a plurality of first air pillars in the meshed heat-conducting layer.   
     
     
         16 . The heat dissipation structure as claimed in  claim 15 , wherein the shape of each of the first holes is cycle, ellipse, rectangle, trapezoid or triangle. 
     
     
         17 . The heat dissipation structure as claimed in  claim 15 , wherein the electronic device further has a heat-generating component, and the heat dissipation structure is disposed between the heat-generating component and the casing. 
     
     
         18 . The heat dissipation structure as claimed in  claim 17 , wherein the second heat-conducting sheet is located between the heat-generating component and the first heat-conducting sheet, and the thickness of the second heat-conducting sheet is greater than the thickness of the first heat-conducting sheet. 
     
     
         19 . The heat dissipation structure as claimed in  claim 17 , further comprising a glue layer, wherein the glue layer is adhered between the first heat-conducting sheet and the casing, the second heat-conducting sheet faces the heat-generating component and the glue layer further has a plurality of second holes so as to form a plurality of second air pillars in the glue layer. 
     
     
         20 . The heat dissipation structure as claimed in  claim 17 , further comprising a thermal glue, wherein the thermal glue is adhered between the second heat-conducting sheet and the heat-generating component, the first heat-conducting sheet faces the casing and the first heat-conducting sheet and the casing are separated by an interval.