Inventor · disambiguated record
Tsukasa Hirayama
Also filed as: HIRAYAMA TSUKASA
11 granted patents·2 pending applications·82 citations·filing 1985–2022
86Inventor score
Top patents by PatentIndex Score
13 records- 0187US7581335B2Substrate drying processing apparatus, method, and program recording mediumTOKYO ELECTRON LTD·Filed 2006·Granted Sep 1, 2009·18 cites·16 claims
- 0283US4662911AEquipment for trapping particulates in engine exhaust gasNIPPON DENSO CO·Filed 1985·Granted May 5, 1987·54 cites·9 claims
- 0380US11309194B2Substrate liquid treatment apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Apr 19, 2022·3 cites·11 claims
- 0480US11087992B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Aug 10, 2021·1 cites·13 claims
- 0580US10303082B2Image forming apparatusOKI DATA KK·Filed 2017·Granted May 28, 2019·2 cites·15 claims
- 0672US9721813B2Liquid processing apparatus with cleaning jigTOKYO ELECTRON LTD·Filed 2013·Granted Aug 1, 2017·3 cites·8 claims
- 0768US10643874B2Substrate liquid processing apparatus, substrate liquid processing method, and storage mediumTOKYO ELECTRON LTD·Filed 2017·Granted May 5, 2020·1 cites·7 claims
- 0858US12272526B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Apr 8, 2025·0 cites·18 claims
- 0942US9321085B2Substrate processing method, storage medium storing computer program for implementing substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2012·Granted Apr 26, 2016·0 cites·7 claims
- 1040US11062922B2Substrate liquid processing apparatusTOKYO ELECTRON LTD·Filed 2018·Granted Jul 13, 2021·0 cites·12 claims
- 1137US2006009362A1Single crystalline base thin filmINT SUPERCONDUCTIVITY TECH·Filed 2003·Application pending·0 cites
- 1235US2006166831A1Method of forming thin film on base substance via intermediate layerINT SUPERCONDUCTIVITY TECH·Filed 2003·Application pending·0 cites
- 1331US8927461B2Substrate for fabricating superconductive film, superconductive wires and manufacturing method thereofMIYATA SEIKI·Filed 2011·Granted Jan 6, 2015·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →