Inventor · disambiguated record
Tsutomu Hosoda
Also filed as: HOSODA TSUTOMU
10 granted patents·5 pending applications·242 citations·filing 2002–2022
91Inventor score
Top patents by PatentIndex Score
15 records- 0196US8536622B2Semiconductor device and power supply apparatusFUJITSU SEMICONDUCTOR LTD·Filed 2013·Granted Sep 17, 2013·34 cites·10 claims
- 0295US8541815B2High electron mobility transistor circuitTAKEMAE YOSHIHIRO·Filed 2012·Granted Sep 24, 2013·21 cites·6 claims
- 0393US8569124B2Method of manufacturing compound semiconductor device with gate electrode forming before source electrode and drain electrodeAKIYAMA SHINICHI·Filed 2011·Granted Oct 29, 2013·20 cites·4 claims
- 0491US9099545B2Compound semiconductor device and method of manufacturing sameTRANSPHORM JAPAN INC·Filed 2013·Granted Aug 4, 2015·13 cites·14 claims
- 0589US9536967B2Recessed ohmic contacts in a III-N deviceTRANSPHORM INC·Filed 2014·Granted Jan 3, 2017·15 cites·24 claims
- 0687US7211897B2Semiconductor device and method for fabricating the sameFUJITSU LTD·Filed 2003·Granted May 1, 2007·47 cites·9 claims
- 0786US6707156B2Semiconductor device with multilevel wiring layersFUJITSU LTD·Filed 2003·Granted Mar 16, 2004·44 cites·20 claims
- 0885US6861755B2Semiconductor deviceFUJITSU LTD·Filed 2003·Granted Mar 1, 2005·38 cites·19 claims
- 0964US6686285B2Semiconductor device manufacture method preventing dishing and erosion during chemical mechanical polishingFUJITSU LTD·Filed 2002·Granted Feb 3, 2004·9 cites·12 claims
- 1051US2024421139A1Module assembly of multiple semiconductor devices with insulating substratesTRANSPHORM TECH INC·Filed 2022·Application pending·0 cites
- 1150US2013228827A1Semiconductor device, manufacturing method and transistor circuitFUJITSU SEMICONDUCTOR LTD·Filed 2013·Application pending·0 cites
- 1247US2007170591A1Semiconductor device and method for fabricating the sameFUJITSU LTD·Filed 2007·Application pending·0 cites
- 1346US2012091986A1Semiconductor device and power supply apparatusTAKEMAE YOSHIHIRO·Filed 2011·Application pending·0 cites
- 1443US7390741B2Method for fabricating semiconductor deviceFUJITSU LTD·Filed 2004·Granted Jun 24, 2008·1 cites·10 claims
- 1539US2013193485A1Compound semiconductor device and method of manufacturing the sameFUJITSU SEMICONDUCTOR LTD·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →